... with Standards such as Joint Electron Device Engineering Council (JEDEC) and Institute for Printed Circuits (IPC) is to the best of our knowledge lacking. To fill this gap, a detailed review of failure mechanism driven reliability models, with emphasis on physics of failure (PoF) for power electronics...

... is independent of the stress path and the yield surfaces are always circular in the principal stress space [ 13 ]. HISS can overcome these flaws. HISS plasticity model with DSC is used in formulating the material behavior in developing the deterministic part of the work presented here. Physics of failure...

.... As such, the stress had to be larger than in the real case and couple too much calculation noise inside. In the new model, the element-type solution was used to obtain a smooth distribution on the plot and prevent deviation. Failure analysis MEMS Microsystems Physics of failure Reliability Sensors...

... manuscript received January 12, 2018; published online May 9, 2018. Assoc. Editor: Reza Khiabani. 20 09 2017 12 01 2018 Composite materials Physics of failure Thermal analysis Thermal interface materials (TIMs) play a crucial role in removing waste heat from the chip...

... and mechanism they considered. However, the fatigue strength exponent they used is material dependent. The exponent is very conservative (i.e., leads to longer test time/test level) as compared to the physics-of-failure-based strain-cycles model for lead free solder joints, explained earlier (4) G t e...

... LECTRONIC P ACKAGING . Manuscript received September 28, 2017; final manuscript received January 4, 2018; published online March 2, 2018. Assoc. Editor: Sreekant Narumanchi. 28 09 2017 04 01 2018 Composite materials DCA Electronic Failure analysis Harsh environment Physics...

...) Virtual techniques: Schemes of validated simulations allow capturing the physics of failure (PoF) proactively in the design for reliability (DfR) process; and (iii) Prognostics health management (PHM). A new concept is introduced for adding a minimum of PHM features at various levels of automotive...

...-Shao Lai. 25 07 2017 19 09 2017 Displays Physics of failure Reliability Edge-lit light guides are a common source of illumination for LCD displays in televisions, monitors, and laptop or tablet computers. A polymeric light diffusing plate is illuminated at its edges...

... August 25, 2017. Assoc. Editor: Eric Wong. 22 03 2017 04 06 2017 Physics of failure Reliability where v represents the vertical displacement at the peel force location, a represents the crack length, P represents the peel force, b represents the sample width...

... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 18, 2016; final manuscript received January 3, 2017; published online June 14, 2017. Assoc. Editor: Toru Ikeda. 18 05 2016 03 01 2017 Failure analysis Harsh environment Microsystems Physics of failure Reliability SMT...

... online June 12, 2017. Assoc. Editor: S. Ravi Annapragada. 14 12 2016 30 03 2017 3D packaging Electrical design Physics of failure Reliability Managing the effects of mechanical stress in silicon chips is a growing challenge—both in order to optimize the device performance...

... ACKAGING . Manuscript received December 16, 2016; final manuscript received March 24, 2017; published online April 24, 2017. Assoc. Editor: Justin A. Weibel. 16 12 2016 24 03 2017 Electronic Failure analysis Harsh environment Physics of failure Reliability Thermal analysis...

... September 17, 2016; final manuscript received December 19, 2016; published online January 16, 2017. Assoc. Editor: Eric Wong. 17 09 2016 19 12 2016 Physics of failure Plastic Electronics Reliability Due to its amorphous nature and topographical imperfection, polymeric...

... with the buildup of the 3D stack [ 3 ]. 3D packaging Chip stacking Failure analysis Physics of failure Thermal analysis 22 07 2015 30 08 2015 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING...

... than the principal directions of the structure was examined. This method was found to have significant limitations, but showed better agreement with simultaneous multiaxial vibration experiments. Failure analysis Harsh environment Physics of failure Reliability During their life-cycle...

... inspection physics of failure Embedded electronics are often exposed to harsh working conditions. They are submitted to high stress levels of combined, thermal and mechanical origins. The origin of the stress may be external—for example environmental; it may also be internal—a consequence...