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Keywords: SiO2-SiO2 bonding
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2025, 147(1): 010801.
Paper No: EP-23-1084
Published Online: July 25, 2024
... groups, and (d) SiO2-SiO2 bonding and Cu-Cu bonding [70] Actually, the bonding process always combines of Cu-Cu and SiO 2 -SiO 2 bonding. Direct Bond Interconnect (DBI) is a bonding technology proposed first by Ziptronix in 2009 [ 70 ]. The bonding process is shown in Fig. 15 . After forming...
Topics:
Bonding
