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Keywords: Thermal analysis
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
Published Online: September 10, 2018
.... Assoc. Editor: Jeffrey C. Suhling. 31 07 2017 02 08 2018 BGA BT Composite materials PBGA Reliability SMT Thermal analysis Warpage behavior is an important thermal–mechanical characteristic of ball grid array (BGA) devices [ 1 , 2 ]. The mechanism of BGA device warpage...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041003.
Paper No: EP-17-1047
Published Online: August 20, 2018
... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 3, 2017; final manuscript received July 16, 2018; published online August 20, 2018. Assoc. Editor: Jeffrey C. Suhling. 03 05 2017 16 07 2018 Physics of failure Reliability Solder Thermal analysis...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. December 2018, 140(4): 040801.
Paper No: EP-17-1128
Published Online: August 20, 2018
... packaging Thermal analysis Worldwide efforts in minimizing CO 2 emissions, resulting from growing concerns about the effects of greenhouse gases on climate, have been a major driver in increasing electrification. As societies gravitate toward a more electricity-based future, power electronics...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041002.
Paper No: EP-18-1007
Published Online: August 3, 2018
... packaging Chip stacking Electrical design Flip chip Micro vias Reliability Thermal analysis Through-silicon via (TSV)-based three-dimensional (3D) integration presents a path toward reduced delay, reduced power consumption, higher performance, smaller packaging size, and heterogeneous...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031006.
Paper No: EP-17-1110
Published Online: June 11, 2018
... materials Conductive adhesives Harsh environment Nanotechnolgy Reliability Thermal analysis Heat dissipation is a major challenge in high performance electronic devices. Moore's law [ 1 ] states that the number of functional units per unit area of integrated circuits doubles every two years...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031003.
Paper No: EP-17-1081
Published Online: May 11, 2018
... 31, 2018; published online May 11, 2018. Assoc. Editor: Baris Dogruoz. 14 09 2017 31 01 2018 3D packaging Dielectrics Microsystems Power packaging Solder Thermal analysis The rapid increase in heat dissipation of next-generation integrated circuits necessitates...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031001.
Paper No: EP-17-1046
Published Online: May 10, 2018
... environment Reliability Thermal analysis Nowadays, application of outdoor electronics in daily life is constantly growing. Its deployment in climatically harsh environment creates a significant challenge for engineers to design reliable and durable electronic devices and systems. As a consequence...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020906.
Paper No: EP-18-1003
Published Online: May 9, 2018
...: Kaushik Mysore. 09 01 2018 12 04 2018 Conformal coatings Electronic Thermal analysis The current performance of supercomputers, power devices, electric vehicles, and advanced military avionics is often limited by the ability to dissipate heat. An enhanced cooling of high...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020901.
Paper No: EP-17-1092
Published Online: May 9, 2018
... manuscript received January 12, 2018; published online May 9, 2018. Assoc. Editor: Reza Khiabani. 20 09 2017 12 01 2018 Composite materials Physics of failure Thermal analysis Thermal interface materials (TIMs) play a crucial role in removing waste heat from the chip...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020902.
Paper No: EP-17-1094
Published Online: May 9, 2018
... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received September 23, 2017; final manuscript received December 4, 2017; published online May 9, 2018. Assoc. Editor: Reza Khiabani. 23 09 2017 04 12 2017 Electronic Thermal analysis Cooling was reported...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021001.
Paper No: EP-17-1126
Published Online: May 9, 2018
... ACKAGING . Manuscript received November 30, 2017; final manuscript received February 23, 2018; published online May 9, 2018. Assoc. Editor: Ankur Jain. 30 11 2017 23 02 2018 3D packaging Thermal analysis Three-dimensional (3D) stacked integrated circuit (IC) chips that stack...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021002.
Paper No: EP-17-1125
Published Online: May 9, 2018
..., 2017; final manuscript received March 16, 2018; published online May 9, 2018. Assoc. Editor: Baris Dogruoz. 30 11 2017 16 03 2018 Thermal analysis The present paper reports the design and the experimental evaluation of a completely passive thermosyphon system to cool down...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010905.
Paper No: EP-17-1099
Published Online: March 2, 2018
.... 27 09 2017 28 12 2017 3D packaging Chip stacking Harsh environment Thermal analysis The adequate selection of the temperature sensor locations within a microchip or a rack of microprocessors may allow a reduction in the number of sensors needed to characterize the thermal...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
Published Online: March 2, 2018
... of failure Power packaging Solder Thermal analysis High-temperature electronics and next generation power electronics operate at temperatures above 200 °C. Conventional Sn based compositions have very high homologous temperatures at these operating conditions which result in rapid microstructural...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010901.
Paper No: EP-17-1085
Published Online: March 2, 2018
... Electronic Embedded passives Reliability Telecommunications Thermal analysis Air cooling technologies are becoming increasingly challenged to address the heat dissipation rates and heat densities arising in next-generation electronic systems, with acoustic noise, air-cooling capability, and fan...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010904.
Paper No: EP-17-1093
Published Online: March 2, 2018
...: Kaushik Mysore. 22 09 2017 19 12 2017 Composite materials Electronic PWB Design Thermal analysis The revolutionary field of electromagnetic metamaterials [ 1 – 3 ] served as a foundation for the field of thermal metamaterials, which has grown significantly within the last...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010907.
Paper No: EP-17-1109
Published Online: March 2, 2018
.... 13 10 2017 28 11 2017 Thermal analysis A raised floor data center is a facility housing computer systems and associated components. Such facilities are commonly cooled using air supplied by the computer room air handler (CRAH) units to the information technology (IT) equipment...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010902.
Paper No: EP-17-1087
Published Online: March 2, 2018
... 2017 Electronic Failure analysis Thermal analysis The global conditions in a data center are determined by computer room air conditioning (CRAC) set point temperature, mass flow rate of cold air being supplied to the room, and overall heat load for the room. Local conditions...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041011.
Paper No: EP-17-1021
Published Online: October 27, 2017
... October 10, 2017; published online October 27, 2017. Assoc. Editor: Pradip Dutta. 16 02 2017 10 10 2017 Electronic Thermal analysis Significant improvements have been made to the operation of air movers within information technology (IT) equipment over the last decade...
Topics: Fans, Temperature
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041012.
Paper No: EP-17-1022
Published Online: October 27, 2017
... LECTRONIC P ACKAGING . Manuscript received February 19, 2017; final manuscript received September 21, 2017; published online October 27, 2017. Assoc. Editor: Pradip Dutta. 19 02 2017 21 09 2017 Electronic Thermal analysis The growth and dependence of global commerce, social...