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Keywords: Thermal analysis
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
Published Online: September 10, 2018
... BT Composite materials PBGA Reliability SMT Thermal analysis Warpage behavior is an important thermal–mechanical characteristic of ball grid array (BGA) devices [ 1 , 2 ]. The mechanism of BGA device warpage is related to the coefficient of thermal expansion (CTE) mismatch between...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041003.
Paper No: EP-17-1047
Published Online: August 20, 2018
... of failure Reliability Solder Thermal analysis Solder is an easily meltable alloy commonly used to join two harder metals together in electronic packaging (EP). The use of Tin-Lead (Sn-Pb) solder was common practice for decades. Information of its reliability and life cycle testing results...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. December 2018, 140(4): 040801.
Paper No: EP-17-1128
Published Online: August 20, 2018
...), energy storage, public transportation, and particularly hybrid and electric vehicles result largely from this concerted effort and are driving the need for better power electronics technologies. Power packaging Thermal analysis 11 12 2017 09 07 2018 Contributed...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041002.
Paper No: EP-18-1007
Published Online: August 3, 2018
... and Transient Thermal Analysis of Hot Spots in 3D Stacked ICs Using Dedicated Test Chips ,” 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium , San Jose, CA, Mar. 20–24, pp. 131 – 137 . 10.1109/STHERM.2011.5767190 [19] Lee , Y.-J. , and Lim , S. K. , 2011 , “ Co...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031006.
Paper No: EP-17-1110
Published Online: June 11, 2018
... ]. Composite materials Conductive adhesives Harsh environment Nanotechnolgy Reliability Thermal analysis 15 10 2017 09 04 2018 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031003.
Paper No: EP-17-1081
Published Online: May 11, 2018
... OF E LECTRONIC P ACKAGING . Manuscript received September 14, 2017; final manuscript received January 31, 2018; published online May 11, 2018. Assoc. Editor: Baris Dogruoz. 14 09 2017 31 01 2018 3D packaging Dielectrics Microsystems Power packaging Solder Thermal analysis...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031001.
Paper No: EP-17-1046
Published Online: May 10, 2018
... Electronic Encapsulant Harsh environment Reliability Thermal analysis Nowadays, application of outdoor electronics in daily life is constantly growing. Its deployment in climatically harsh environment creates a significant challenge for engineers to design reliable and durable electronic devices...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020906.
Paper No: EP-18-1003
Published Online: May 9, 2018
...: Kaushik Mysore. 09 01 2018 12 04 2018 Conformal coatings Electronic Thermal analysis The current performance of supercomputers, power devices, electric vehicles, and advanced military avionics is often limited by the ability to dissipate heat. An enhanced cooling of high...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020901.
Paper No: EP-17-1092
Published Online: May 9, 2018
... particle size distribution (PSD). Composite materials Physics of failure Thermal analysis 20 09 2017 12 01 2018 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received September 20...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020902.
Paper No: EP-17-1094
Published Online: May 9, 2018
... manuscript received December 4, 2017; published online May 9, 2018. Assoc. Editor: Reza Khiabani. 23 09 2017 04 12 2017 Electronic Thermal analysis In direct liquid cooling (DLC) technology, a liquid cooled cold plate is situated on top of a chip, which reduces the thermal...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021001.
Paper No: EP-17-1126
Published Online: May 9, 2018
...) also increase resulting in significant temperature rise and degradation in performance and reliability. The intrachip microfluidic single- or two-phase cooling emerged as a viable solution for 3D-chips architecture and high heat flux applications [ 5 – 13 ]. 3D packaging Thermal analysis...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021002.
Paper No: EP-17-1125
Published Online: May 9, 2018
..., 2018; published online May 9, 2018. Assoc. Editor: Baris Dogruoz. 30 11 2017 16 03 2018 Thermal analysis The present paper reports the design and the experimental evaluation of a completely passive thermosyphon system to cool down a mock-up transistor module. It is well...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010905.
Paper No: EP-17-1099
Published Online: March 2, 2018
.... InfraRed Thermogr. J. , 9 ( 2 ), pp. 177 – 191 . 10.1080/17686733.2012.743697 [18] Sousa, J. , Villafañe, L. , and Paniagua, G. , 2014, “ Thermal Analysis and Modeling of Surface Heat Exchangers Operating in the Transonic Regime ,” Energy , 64 , pp. 961–969. 10.1016/j.energy.2013.11.032...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
Published Online: March 2, 2018
... packaging Solder Thermal analysis 28 09 2017 04 01 2018 One of the objectives of this work was to enhance the thermal conductivity of the die-attach joint. In this part of the work, improvements to the die-attach joining were pursued to further enhance the thermal conductivity...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010901.
Paper No: EP-17-1085
Published Online: March 2, 2018
... Electronic Embedded passives Reliability Telecommunications Thermal analysis Air cooling technologies are becoming increasingly challenged to address the heat dissipation rates and heat densities arising in next-generation electronic systems, with acoustic noise, air-cooling capability, and fan...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010904.
Paper No: EP-17-1093
Published Online: March 2, 2018
... September 22, 2017; final manuscript received December 19, 2017; published online March 2, 2018. Assoc. Editor: Kaushik Mysore. 22 09 2017 19 12 2017 Composite materials Electronic PWB Design Thermal analysis The revolutionary field of electromagnetic metamaterials [ 1 – 3...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010907.
Paper No: EP-17-1109
Published Online: March 2, 2018
... (open area ratio), size and shape of openings, solid margin around tile, and the presence of understructure scoops, guiding fins, or dampers. Therefore, the perforated floor tiles are complex components of a data center that play a key role in its cooling performance. Thermal analysis 13...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010902.
Paper No: EP-17-1087
Published Online: March 2, 2018
.... Editor: Ercan Dede. 18 09 2017 29 11 2017 Electronic Failure analysis Thermal analysis The global conditions in a data center are determined by computer room air conditioning (CRAC) set point temperature, mass flow rate of cold air being supplied to the room, and overall...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041011.
Paper No: EP-17-1021
Published Online: October 27, 2017
... blower type fans as the primary air moving devices within their chassis. Electronic Thermal analysis 16 02 2017 10 10 2017 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received...
Topics: Fans, Temperature
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041012.
Paper No: EP-17-1022
Published Online: October 27, 2017
... LECTRONIC P ACKAGING . Manuscript received February 19, 2017; final manuscript received September 21, 2017; published online October 27, 2017. Assoc. Editor: Pradip Dutta. 19 02 2017 21 09 2017 Electronic Thermal analysis The growth and dependence of global commerce, social...