...Xingjun Yao; Weijie Jiang; Jiahui Yang; Junjie Fang; Wenjun Zhang This paper presents a new approach to formulating an analytical model for the underfill process in flip-chip packaging to predict the flow front and the filling time. The new approach is based on the concept of surface energy along...

...X. J. Yao; J. J. Fang; Wenjun Zhang The notion of permeability is very important in understanding and modeling the flow behavior of fluids in a special type of porous medium (i.e., the underfill flow in flip-chip packaging). This paper presents a new concept regarding permeability in a porous...

...Byung-Seung Yim; Young-Eui Shin; Jong-Min Kim In this work, a novel ball grid array (BGA) interconnection process has been developed using solderable polymer–solder composites (SPCs) with low-melting-point alloy (LMPA) fillers to enhance the processability of the conventional capillary underfill...

... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...

...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...

... and discussed here. More specifically, different fracture characterization techniques on (a) freestanding “thin” solder-resist films and (b) filled “bulk” epoxy materials such as underfills and epoxy mold compounds are investigated. For thin films, learnings from different test methods for measuring fracture...

... analysis Underfill Three-dimensional integrated circuits (3D ICs) are fabricated by stacking multiple devices or die together and making interconnection between them [ 1 , 2 ]. There are several advantages of 3D ICs compared to traditional two-dimensional ICs. For example, the overall system...

... in advanced microelectronic packages at room and high temperatures. Those interfaces include silicon–epoxy underfill, solder resist–epoxy underfill and epoxy mold compounds (EMCs), and die passivation materials–epoxy underfill materials. A unique sample preparation technique was developed for DCB testing...

... of dissipated heat and thermal interfaces from each integrated die. To reduce the overall thermal resistance and thereby the thermal gradients, this publication will provide an overview of several studies on the formation of sequential thermal underfills that result in percolation and quasi-areal thermal...

...John H. Lau Recent advances in flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be presented in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended. Fig...

... manuscript received March 15, 2015; published online May 21, 2015. Assoc. Editor: Eric Wong. 30 09 2014 15 03 2015 21 05 2015 In this study, the reliability performance of two capillary-type underfill materials with different glass transition temperatures (T g ) and coefficients...

..., the state-of-the-art, challenge, and trend of 3D integration will be presented and examined. Furthermore, supply chain readiness for high volume manufacturing (HVM) of TSVs is discussed. 3D packaging Micro vias Microsystems Underfill Wirebond Fig. 10 Micron’s sample on HMC [ 140...

...Z. Kornain; A. Jalar; R. Rasid; S. Abdullah Phenolic and amine epoxy systems are widely used as hardeners in underfill materials for flip chip packaging. A comparison was made between these two systems in order to evaluate the reliability performance of a flip chip plastic ball grid array (FC-PBGA...

..., the numerical results indicated a ratio of conductivity of filler to matrix for achieving the maximum thermal conductivity. composite materials electronics packaging finite element analysis polymers thermal conductivity composite materials thermal analysis encapsulant underfill finite element...

...Chao-Ming Lin; Win-Jin Chang; Te-Hua Fang This study aims to enhance the flow rate and reduce the filling time in flip-chip underfill packaging by combining capillary force, pressure difference, and inertia effects. In the designed underfill apparatus, the capillary force effect is developed...

... of the surface laminar layer and the embedded microstructures. The displacement fields are analyzed to produce the deformed configuration of the surface laminar layer and the strain distributions in the microstructures. The high modulus of underfill produces a strong coupling between the chip and the surface...