... Suhir , E. , 1986 , “ Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies ,” Proceedings of the ISHM International Symposium on Microelectronics , Atlanta GA , pp. 383 – 392 . 16 Brown , W. D. , 1999 , Advanced Electronic Packaging ( IEEE , Piscataway...

... silicon chip alumina substrate adhesive bonding alumina ductility elemental semiconductors gold integrated circuit bonding scanning electron microscopy silicon thermal expansion 22 10 2010 26 02 2011 22 06 2011 22 06 2011 2011 American Society of Mechanical...

... resistance. 17 01 2006 09 09 2007 08 05 2008 adhesive bonding anisotropic media conductive adhesives contact resistance delamination elastic moduli integrated circuit packaging internal stresses resins anisotropic conductive adhesive bonding force adhesion strength...

... 27 10 2006 adhesive bonding flip-chip devices integrated circuit reliability flip chip anisotropic conductive adhesive FR-4 sequential build-up process reliability The primary drivers in the electronics industry can be summarized as higher frequency, lower cost, more...

... extensively in high-density electronics such as (PDA), mobile phone, (LCD), smart cards, and disk drives 2 . ACF Bumpless Reflow Reliability silicon conducting polymers polymer films aluminium chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive...

... integrated circuit interconnections flip-chip devices failure analysis thermal analysis delamination adhesive bonding anisotropic media deformation Weibull distribution acoustic microscopy Anisotropic Conductive Adhesive Joint Moire´ Interferometry Thermal Deformation Thermal Cycling...

... circuit interconnections integrated circuit reliability adhesion fracture toughness testing adhesive bonding ageing scanning electron microscopy integrated circuit packaging substrates Anisotropic Conductive Adhesive (ACA) Moisture Effect Peel Strength During the past few years...

... conducting polymers indium alloys tin alloys adhesives filler metals solders adhesive bonding electronics packaging curing differential scanning calorimetry As electronic packaging technologies proceed to higher density, smaller size, higher performance and lower cost, the area type package...

.... C. Chan. 06 January 2004 08 June 2004 21 03 2005 chip scale packaging adhesive bonding wafer bonding adhesives organic compounds fracture toughness tensile strength tensile testing Wafer bonding may be considered as one of the enabling techniques, extending...

... packaging adhesives chip scale packaging adhesive bonding encapsulation integrated circuit reliability chip-on-board packaging Many simple processes for flip chip assemblies at low costs have been developed 1 2 3 4 5 . There are many options to select from for a particular application...

...–751]. Based on the aforementioned advantages, it is worth investigating the bonding properties at different curing conditions. In this work, a new type of UV curable ACA for chip-on-flex application is presented. The adhesive bonds of the chip-on-flex application are cured at different cure cycles...

... on a Chip ,” Science , 280 , pp. 1046 – 1050 . Niklaus , F. , Enoksson , P. , Ka¨lvesten , E. , and Stemme , G. , 2001 , “ Low-Temperature Full Wafer Adhesive Bonding ,” J. Micromech. Microeng. , 11 , pp. 100 – 107 . den Besten, C., van Hal, R. E. G., Munoz, J., and Bergveld...