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Keywords: adhesives
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 130–136.
Published Online: February 14, 2006
.... Typically, thermal interfaces are filled with materials such as thermal adhesives and greases. Interface materials reduce the contact resistance between the mating heat generating and heat sinking units by filling voids and grooves created by the nonsmooth surface topography of the mating surfaces, thus...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 177–183.
Published Online: August 7, 2005
...Liu Caroline Chen; Zonghe Lai; Zhaonian Cheng; Johan Liu Isotropic conductive adhesives (ICA) are gaining more and more application interests in electronic manufacturing, however, their failure mechanism is not been fully understood. In this paper we present reliability investigations...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
... chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance surface morphology ageing corrosion testing swelling humidity ACF...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 29–32.
Published Online: March 21, 2005
...Z. W. Zhong Flip chips using various adhesives were studied. The assembly yields using nonconductive adhesive and anisotropic conductive film investigated were 97% and 100%, respectively. A packaging process using anisotropic conductive paste with a 100% packaging yield was developed. All...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 52–58.
Published Online: March 21, 2005
...K. K. Lee; S. C. Tan; Y. C. Chan Generally, adhesive materials can be cured in a short time under high curing temperature. High curing temperature usually leads to an increase in cross-link density and a homologous increase in heat resistance. Nevertheless, curing process under high temperature...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 12–17.
Published Online: March 21, 2005
...Kiyokazu Yasuda; Jong-Min Kim; Kozo Fujimoto In order to conquer the limitation of conventional solders and adhesives used in electronics packaging, a novel self-organized joining process using conductive adhesive with low melting point alloy was proposed. As a basic characteristic of the adhesive...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 7–11.
Published Online: March 21, 2005
...A. Polyakov; M. Bartek; J. N. Burghartz This paper reports on an area-selective adhesive wafer bonding, using photosensitive BCB from Dow Co. The strength of the fabricated bonds is characterized using the wedge-opening and tensile methods. The measured fracture toughness is 53.5 ± 3.9 J / m 2...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 370–374.
Published Online: March 9, 2005
...X. B. Chen In electronics packaging, one of the key processes is dispensing fluid materials, such as adhesive, epoxy, encapsulant, onto substrates or printed circuit boards for the purpose of surface mounting or encapsulation. In order to precisely control the dispensing process, the understanding...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 375–380.
Published Online: February 14, 2005
... of the particle and exposing the underlying polymeric portion were also observed. 20 02 2004 14 02 2005 anisotropic media electronics packaging mechanical contact contact resistance abrasion friction mechanical testing adhesives anisotropic conductive film (ACF) mechanical shock...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 91–95.
Published Online: November 25, 2004
...Andrzej Mościcki; Jan Felba; Tadeusz Sobierajski; Józef Kudzia Pb-free soldering and the use of electrically conducive adhesives in the electronics industry are a segment of the global trend towards a lead-free environment. In comparison to lead-free solders, current commercial isotropic conductive...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 82–86.
Published Online: April 30, 2004
... must therefore be controlled by selecting the appropriate mechanical properties of the adhesive film (ACF or NCF) and the build-up substrate material. Moreover, the interconnection reliability during moisture-resistance tests deteriorates because of stress relaxation near the glass-transition...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 609–616.
Published Online: December 15, 2003
...G. B. Dou; Y. C. Chan; Johan Liu In anisotropic conductive adhesive (ACA) interconnections, the particles are electrical conductors providing current paths in the fine pitch electronic packaging as well as physical parts connecting with the chip bumps and the substrate pads through the mechanical...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 624–629.
Published Online: December 15, 2003
...N. H. Yeung; Y. C. Chan; C. W. Tan Finite element analysis was used to model the transient heat transfer problem and the mechanical influence of the conducting particle in the anisotropic conductive adhesive (ACF). Three-dimensional (3D) brick element was performed for the transient heat transfer...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 93–97.
Published Online: March 14, 2003
...C. M. Lawrence Wu; Robert K. Y. Li; N. H. Yeung Isotropic conductive adhesives (ICA) have been considered as replacement materials for lead-tin solder alloys. In this paper, the post-impact shear strength of ICA surface mount (SM) joints was obtained experimentally and compared with that of SM lead...
Journal Articles
Article Type: Editorial
J. Electron. Packag. December 2002, 124(4): 317.
Published Online: December 12, 2002
...Bernd Michel,, Guest Editor, Poly’2000 Co-chair; Kikuo Kishimoto,, Guest Editor, Poly’2000 Co-chair 12 12 2002 reliability polymers adhesion adhesives plastic packaging integrated circuit packaging fracture mechanics stress effects thermal management (packaging...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 367–370.
Published Online: December 12, 2002
...Ryszard Kisiel The aim of current research presented in my paper is to establish how adhesive composition influences the performance of joints between SMDs and PCBs. For identifying the best adhesive formulation in SMT applications, the experiment design method based on Taguchi techniques...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
Published Online: December 12, 2002
...C. M. Lawrence Wu; Robert K. Y. Li; N. H. Yeung Isotropic conductive adhesives (ICA) have been considered as replacement materials for lead-tin solder alloys. In this paper, the post-impact shear strength of ICA surface mount (SM) joints was obtained experimentally and compared with that of SM lead...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 352–354.
Published Online: December 12, 2002
...A. J. Hudson; S. C. Martin; M. Hubert; J. K. Spelt This paper describes an optical method that has been developed to accurately measure shrinkage during the cure of adhesives treated with UV light. The experiment was designed to measure changes in the volume of very small quantities of material...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 240–245.
Published Online: July 26, 2002
...Johan Liu; Zonghe Lai A reliability study on anisotropically conductive adhesive joints on a Flip-Chip/FR-4 assembly has been carried out. In the study, nine types of anisotropic conductive adhesive (ACA) and one nonconductive film (NCF) were used. In total, nearly one-thousand single joints were...
Journal Articles
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 331–337.
Published Online: May 10, 2001
...K. N. Chiang, Associate Professor; C. W. Chang, Graduate Student; C. T. Lin, Graduate Student Development of flip-chip-on-glass (FCOG) assembly technology using anisotropic conductive adhesive/film (ACA/ACF) is currently underway to achieve fine pitch interconnections between driver IC and flat...