...Chu-Hsuan Sha; Pin J. Wang; Wen P. Lin; Chin C. Lee Silver (Ag) foils are bonded to alumina substrates by a low temperature solid state bonding process. The alumina substrate is premetalized with 40 nm titanium tungsten (TiW) and 2.54 μm gold (Au). The bonding temperature is just 260 °C, compatible...

...Chu-Hsuan Sha; Chin C. Lee Pure gold (Au) is used as a bonding medium to bond silicon (Si) chips to alumina substrates. The bonding process is performed at 260 °C with only 150 psi (1.0 MPa) static pressure applied. This is a solid-state bonding without any molten phase involved. The Au layer...

... Implications for Thermal Applications ,” Appl. Phys. Lett. 0003-6951 10.1063/1.2356113 , 89 , p. 133108 . alumina coolants heat exchangers heat sinks heat transfer nanofluidics turbulence nanofluid heat sink enhancement This work does not report new measurements...

... on thermometer principles to measure thermal impedance and resistance. This device consists of an alumina substrate, titanium tungsten (TiW) layers, gold layers, and thin alumina layers. Then the measured thermal conductivity of the TIM was compared with predictions made by the thermal resistor network model...

...Sihai Wen; D. D. L. Chung The relative dielectric constant (10 kHz) of alumina was found to increase reversibly (by up to 13%) with compressive stress (up to 18 MPa). The effect of stress on the relative dielectric constant diminishes with increasing stress, such that it is almost absent when...

... at 60 °C for 1 h. Then, Teflon tubes were pulled out and PDMS was peeled off. PDMS film adheres on the Pyrex substrate to encapsulate the fabricated microchannel. 03 09 2003 09 08 2004 silicon compounds alumina microfluidics micromachining channel flow electrophoresis...