..., 2012. Assoc. Editor: How T. Lin. 23 12 2011 04 05 2012 Because it is difficult to accurately estimate the electric resistance of anisotropic conductive adhesive (ACA) joints, the ACA’s applications in high density packaging field have been greatly limited. The bulk resistance...

...Melida Chin; S. Jack Hu; James R. Barber Multiple parameters are involved in the design of anisotropic conductive adhesive assemblies, and the overlapping influences that they have on the final electrical contact resistance represent a difficult challenge for the designers. The most important...

... layer in the SBU process. The effect of RCC on the reliability of flip chip joints with anisotropically conductive adhesive film (ACF) was studied. Two substrates were used. The difference between the substrates was RCC laminated on the other substrate. The reliability of the test samples was studied...

..., the need to eliminate lead-based materials as a means of interconnection has renewed the industry’s interest in exploring other means of assembling surface mount devices reliably. The use of a novel anisotropic conductive adhesive (ACA) as a means for assembling surface mount devices, the ACA’s performance...