... be strongly enhanced by subsequent work hardening in mild cycling. microjoints heat sinks copper nanoparticles rapid sintering porosity particle size macroscopic strain inelastic deformation impression creep test diffusion creep dislocations annealing coarsening surface diffusion oxidation...

.... annealing CNT conductive silver ink direct write electrical design flexible circuits graphene inkjet-printed electronics low temperature bonding paper-based electronics microwave organic electronics sensors SOP The current era of passive RF electronic circuits depends heavily...

... thermal gradient (TG) for 286 h, 712 h, and 1156 h. It was observed that samples subjected to thermal gradient did not develop a Cu 3 Sn intermetallic compound (IMC) layer, and we observed disintegration of Cu 6 Sn 5 IMC. On the other hand, samples subjected to isothermal annealing exhibited IMC growth...

...Hong-Seok Min; Young-Chang Joo; Oh-Sung Song We studied cleaning and annealing effects in glass/Si direct bonding using 4 inch Pyrex glass and silicon wafers. SPM cleaning (sulfuric-peroxide mixture, H 2 SO 4 : H 2 O 2 = 4 : 1 , 120 ° C ) , RCA cleaning ( NH 4 OH : H 2 O 2 : H 2 O = 1 : 1 : 5 , 80...

... Mount Solder Joints ,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B , 20 , pp. 87 – 93 . So , A. C. K. , Chan , Y. C. , and Lai , J. K. L. , 1997 , “ Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints ,” IEEE Trans. Compon., Packag. Manuf...