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Keywords: attenuation
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041010.
Paper No: EP-13-1102
Published Online: September 19, 2014
... , “ Advances in the Drop-Impact Reliability of Solder Joints for Mobile Applications ,” Microelectron. Reliab. , 49 ( 2 ), pp. 139 – 149 . 10.1016/j.microrel.2008.12.001 [5] Nunziato , J. W. , and Schuler , K. W. , 1973 , “ Shock Pulse Attenuation in a Nonlinear Viscoelastic Solid ,” J. Mech...
