1-2 of 2
Keywords: board-level drop test
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Hung-Jen Chang, Chau-Jie Zhan, Tao-Chih Chang, Jung-Hua Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011011.
https://doi.org/10.1115/1.4005956
Published Online: March 19, 2012
... , T. , 2001 , “ Trend of Halogen Free Printed Wiring Board Materials ,” Proceedings of EcoDesign , pp. 1026 – 1031 . 5 Subassembly Mechanical Shock, 2004 , JESD22-B110A. 6 Board Level Drop Test Method of Components for Handheld Electronic Products, 2003 , JESD22-B111. 7 Pan , K...
View Article titled, Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under <span class="search-highlight">Board</span>-<span class="search-highlight">Level</span> <span class="search-highlight">Drop</span> <span class="search-highlight">Test</span>
Open the PDF for Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under <span class="search-highlight">Board</span>-<span class="search-highlight">Level</span> <span class="search-highlight">Drop</span> <span class="search-highlight">Test</span> in another window
Topics: Failure, Failure analysis, Fracture (Materials), Intermetallic compounds, Lead-free solders, Printed circuit board assemblies, Solder joints, Solders, Stress, Tin
Journal Articles

Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages

Yi-Shao Lai, Chang-Lin Yeh, Ching-Chun Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2007, 129(1): 105–108.
https://doi.org/10.1115/1.2429717
Published Online: June 6, 2006
..., the package with smaller solder joints and a smaller joint pitch suffers a greater drop reliability concern. 22 01 2006 06 06 2006 chip scale packaging circuit reliability solders mechanical testing transient analysis printed circuit testing board-level drop test WLCSP...
View Article titled, Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages
Open the PDF for Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages in another window
Topics: Reliability, Semiconductor wafers, Solder joints, Transient analysis