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Keywords: capillary underfilling
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011001.
Paper No: EP-22-1076
Published Online: April 5, 2024
... difference between the TSAM BGA chips experiments and its simulation counterparts in the range of 0.089–3.65%. 1 Corresponding author. e-mail: aizatabas@usm.my 20 10 2022 28 02 2024 05 04 2024 ball-grid array underfilling process capillary underfilling neural...
