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Keywords: chimney
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041005.
Paper No: EP-13-1106
Published Online: September 19, 2014
... presents designs utilizing the effects of chimney cooling, well developed for other fields that reduce heat sink resistances by significant amounts while meeting all other requirements for bulb system design. Numerical studies and test data show performance of 3–4 °C/W for various orientations including...