... micropin fin sinks. Results of this experimental study may be used for designing the cooling high power laser and rocket-born electronic devices. pin-fin microchannel varying high heat flux chip cooling infrared Breakthroughs in many of today's technologies are becoming increasingly...

... , J. , and Zhou , Y. X. , 2002 , “ A Computer Chip Cooling Method Which Uses Low Melting Point Metal and Its Alloys as the Cooling Fluid ,” China Patent No. 021314195. 9 Miner , A. , and Ghoshal , U. , 2004 , “ Cooling of High-Power-Density Microdevices Using Liquid Metal...

... engineering DP industry gallium alloys liquid metals thermal resistance liquid metal cooling electromagnetic pump high performance CPUs heat transfer enhancement thermal management chip cooling The last five decades have witnessed great prosperity and development of very large scale...

... and steady operations is reduced if the frequency is high. However, flow frequency has nearly no effect on the pressure drop in the channel. 09 06 2008 27 09 2008 13 02 2009 channel flow finite element analysis thermal management (packaging) transients chip cooling flow...

... W ∕ cm 2 , since the maximum allowed pressure drop is ∼ 1600 Pa . 30 09 2005 15 11 2005 cooling integrated circuit packaging thermal conductivity thermal resistance graphite vapor chamber graphite foam heat spreader chip cooling As a result...

... trajectories of the obstruction block on chip cooling were investigated. A numerical algorithm PISO , a conjugate heat transfer scheme for fluid-solid thermal interactions with moving grids was used to solve a coupled system of governing equations. The study shows that the induced trajectories...