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Keywords: chip cooling
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021003.
Paper No: EP-13-1064
Published Online: April 29, 2014
... micropin fin sinks. Results of this experimental study may be used for designing the cooling high power laser and rocket-born electronic devices. pin-fin microchannel varying high heat flux chip cooling infrared Breakthroughs in many of today's technologies are becoming increasingly...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041009.
Published Online: December 9, 2011
.... , 2002 , “ A Computer Chip Cooling Method Which Uses Low Melting Point Metal and Its Alloys as the Cooling Fluid ,” China Patent No. 021314195. 9 Miner , A. , and Ghoshal , U. , 2004 , “ Cooling of High-Power-Density Microdevices Using Liquid Metal Coolants ,” Appl. Phys. Lett. , 85...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031009.
Published Online: September 9, 2010
... engineering DP industry gallium alloys liquid metals thermal resistance liquid metal cooling electromagnetic pump high performance CPUs heat transfer enhancement thermal management chip cooling The last five decades have witnessed great prosperity and development of very large scale...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011011.
Published Online: February 13, 2009
... and steady operations is reduced if the frequency is high. However, flow frequency has nearly no effect on the pressure drop in the channel. 09 06 2008 27 09 2008 13 02 2009 channel flow finite element analysis thermal management (packaging) transients chip cooling flow...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 427–431.
Published Online: November 15, 2005
.../ Hagen , K. D. , 1999 , Heat Transfer With Applications , Prentice-Hall , Englewood Cliffs, NJ . 30 09 2005 15 11 2005 cooling integrated circuit packaging thermal conductivity thermal resistance graphite vapor chamber graphite foam heat spreader chip cooling...
Journal Articles