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Keywords: circuit optimisation
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 9–18.
Published Online: September 21, 2006
...) between materials used in the package. These stresses and related strains are an important factor leading to early solder joint failure. thermal management (packaging) solders printed circuits thermal expansion fatigue testing reliability finite element analysis circuit...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 90–97.
Published Online: April 19, 2006
... is applied to a test case involving placement optimization of several heat generating electronics components on a PCB. 12 12 2005 19 04 2006 printed circuit design thermal management (packaging) genetic algorithms neural nets circuit optimisation electronic component placement...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 59–66.
Published Online: March 21, 2005
... circuits integrated circuit packaging integrated circuit design thermal analysis circuit optimisation electronic engineering computing Integrated Design Optimization Integrated Power Electronic Module Thermal Analysis While thermal management is a key enabling technology for the next...