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Keywords: circuit reliability
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011001.
Published Online: February 11, 2009
... such an index of the first several cycles is followed in the predictions. 23 08 2007 15 04 2008 11 02 2009 ball grid arrays chip scale packaging circuit reliability numerical analysis thermal analysis An earlier version of this paper was published in Proceedings of IMECE 2007...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021007.
Published Online: May 8, 2008
.... circuit reliability circuit simulation elastic moduli printed circuit design printed circuit testing solders PCB FE simulation modal test drop test 30 03 2007 10 09 2007 08 05 2008 Handheld electronic products such as personal digital assistant and mobile phone...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2007, 129(1): 105–108.
Published Online: June 6, 2006
... . 22 01 2006 06 06 2006 chip scale packaging circuit reliability solders mechanical testing transient analysis printed circuit testing board-level drop test WLCSP reliability JEDEC The wafer-level chip-scale package (WLCSP) contains a bare die, whose electrical...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
Published Online: March 14, 2003
... Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division, March 19, 2002. Associate Editor: Y.-H. Pao. 19 March 2002 14 03 2003 plastic packaging assembling circuit reliability failure analysis ball grid arrays surface...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 98–103.
Published Online: March 14, 2003
... Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division, October 1, 2001. Associate Editor: B. Michel. 01 October 2001 14 03 2003 ball grid arrays chip scale packaging circuit...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
Published Online: December 12, 2002
... received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 surface mount technology printed circuit testing bending impact testing impact strength adhesives shear strength interconnections circuit reliability scanning...
Journal Articles
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 385–390.
Published Online: December 12, 2002
... by the EPPD Division October 12, 2001. Associate Editor: Y.-H. Pao. 12 October 2001 12 12 2002 soldering lead alloys tin alloys fatigue cracks ageing cooling granular structure crystal microstructure casting packaging fatigue testing circuit reliability As solder joints...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 240–245.
Published Online: July 26, 2002
... with ultra-fine pitch technology. flip-chip devices adhesives fine-pitch technology conducting polymers circuit reliability environmental testing contact resistance electric resistance measurement filled polymers 27 July 1999 26 07 2002 Contributed by the Electronic...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 254–259.
Published Online: July 26, 2002
... . Manuscript received by the EPPD December 7, 2000. Associate Editor: S. M. Heinrich. 07 December 2000 26 07 2002 fatigue circuit reliability printed circuit manufacture packaging production testing fracture Thin Films Flexible Printed Circuitry (FPC) High Cycle Fatigue...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. June 2002, 124(2): 135–137.
Published Online: May 2, 2002
... circuit reliability soldering 29 December 2000 31 May 2001 02 05 2002 Contributed by the Electronic and Photonic Packaging Division of THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS . Manuscript received by the Electronic and Photonic Packaging Division December 29, 2000; revised...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 69–76.
Published Online: May 2, 2002
... 02 05 2002 creep chip scale packaging soldering printed circuit manufacture circuit reliability tin alloys silver alloys indium The unique physical and mechanical properties of the low-cost tin-lead solders have facilitated printed circuit board (PCB) assembly choices...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 85–90.
Published Online: May 2, 2002
... Editor: S. M. Henrich. 27 September 2000 02 05 2002 tin alloys lead alloys soldering creep circuit reliability printed circuits ball grid arrays Sn-Pb eutectic solders are commonly used in electronic packaging as both a mechanical and electrical connection because...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 45–53.
Published Online: January 1, 2001
... thermal analysis wave soldering printed circuit manufacture stress analysis cooling circuit reliability Integrity of plated through holes (PTHs), as shown in Fig. 1 , has become one of the primary printed wiring board (PWB) reliability concerns either during the component assembly process...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. June 2001, 123(2): 147–155.
Published Online: October 10, 2000
... circuit reliability stress analysis failure analysis finite element analysis thermal stress cracking viscoplasticity interconnections The challenging task in today’s fast paced electronics industry is to accurately assess the reliability at a minimal cost and time. Virtual qualification...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. June 2001, 123(2): 141–146.
Published Online: October 10, 2000
... structures. The bandwidth of the stiffness matrix can be somewhat large in a NFEM mesh because of the nesting scheme. Hence in this study, a reverse Cuthill-Mckee (George et al. 9 ) algorithm is implemented to optimize the bandwidth, and further reduce the computational time. packaging circuit...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 120–126.
Published Online: July 21, 2000
..., 2000. Associate Editor: R. Wirtz. 11 September 1999 21 July 2000 thermal management (packaging) plastic packaging forced convection thermal resistance circuit reliability Forced Convection Electronic Cooling Thermal Resistance Aerodynamic Influence Factors Plastic Quad...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 306–310.
Published Online: June 20, 2000
... mechanics circuit reliability printed circuits plastic deformation thermal stress cracking crack-edge stress field analysis delamination soldering finite element analysis The last decade witnessed an explosive growth in the research and development efforts devoted to solder bumped flip chips...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 294–300.
Published Online: May 15, 2000
... 15 May 2000 plastic packaging flip-chip devices micromechanics circuit reliability shear deformation thermal stresses light interferometry Surface Laminar Circuit Flip Chip Underfill Microscopic Moire´ Interferometry Photosensitive Dielectric Layer Solder Resist Mask Metal...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. March 2001, 123(1): 83–87.
Published Online: April 10, 2000
... as indicator of package reliability. 10 April 2000 plastic packaging circuit reliability flip-chip devices heat sinks design of experiments thermal stress cracking mechanical testing finite element analysis inspection Flip Chip Deformation Thermal and Mechanical Loading...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 115–120.
Published Online: November 9, 1999
... width Z = membership function ε = dielectric constant α = thermal diffusivity thermal management (packaging) temperature distribution multichip modules circuit reliability finite element analysis circuit layout CAD Thermal management is an important...