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Keywords: coatings
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011007.
Published Online: March 19, 2010
... interconnect applications in microelectronics packaging. The Cu particle surface modification by a coupling agent and its effects on the electrical conductivity and thermal stability of Cu-filled ACF joints were investigated for the potential alternatives of conventional Au-coated polymer and Au-coated Ni...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011007.
Published Online: February 4, 2008
...Mark A. Trautman; Murli Tirumala; S. M. You An empirical study of pool nucleate boiling enhanced with a microporous coating was conducted within the context of microprocessor cooling. A thermal test vehicle (TTV) emulated the heat load from a general purpose microprocessor and delivered...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 28–33.
Published Online: October 20, 1999
...Jang-hi Im, Mem. ASME; Edward O. Shaffer, II; Theodore Stokich,, Jr.; Andrew Strandjord; Jack Hetzner; James Curphy; Cheryl Karas; Greg Meyers; David Hawn; Ashok Chakrabarti; Steve Froelicher This work examines the mechanical performance of thin film coatings from Photosensitive-benzocyclobutene...