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Keywords: compactness
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 432–440.
Published Online: February 27, 2006
... Manual, Evanston, Illinois. 03 10 2005 27 02 2006 cooling forced convection electronics packaging electronic cooling forced convection heat transfer density packing compactness constructal design The current miniaturization of heat generating devices...
