1-20 of 42
Keywords: computational fluid dynamics
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011011.
Paper No: EP-21-1002
Published Online: August 6, 2021
... the soldering process. Aiming to understand if such defects are related to the force exerted by the solder wave in the PCB, a numerical and experimental study was performed in this article. For this purpose, a computational fluid dynamic model was developed by using the fluent software to describe...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031116.
Paper No: EP-20-1018
Published Online: August 5, 2020
... the challenges of setting up a computational fluid dynamics (CFD) model of a 180-m 2 small-size high-performance computing (HPC) DC and the validation procedure leading to a reasonably accurate model for the investigation of the thermal environment and potential energy efficiency improvements. Leaky floors...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031120.
Paper No: EP-19-1127
Published Online: May 4, 2020
...Jeho Kim; J. Michael Brown; Yogendra Joshi; Kevin O'Connor; Marcos Diaz; Zhuomin Zhang; Peiyan Yang The use of computational fluid dynamics/heat transfer (CFD/HT) software has become common in exploring the thermal and hydrodynamic behavior of many electronic products. Well-designed CFD/HT models...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021001.
Paper No: EP-18-1068
Published Online: February 25, 2019
...Georgios Karamanis; Marc Hodes We provide an algorithm to optimize the geometry of the fins in an array of longitudinal-fin heat sinks (HSs) in, e.g., a blade server, which is a prohibitively long task using computational fluid dynamics (CFD). First, banks of CFD simulations are run to precompute...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021008.
Published Online: June 11, 2012
... 2012 multiobjective optimization pin-fin heat sinks multiobjective evolutionary algorithms performance comparison computational fluid dynamics High heat dissipation performance of an electronic device is essential in order to maintain a system’s performance and reliability, also...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031011.
Published Online: September 26, 2011
... resistance models was reported thus providing engineers with a design rule to develop efficient µTAS devices. The study did not include the effects of the walls bounding the microposts. In this paper, a three-dimensional computational fluid dynamics model is used to include the effects of three...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011010.
Published Online: March 10, 2011
...A. Kargar; B. Ghasemi; S. M. Aminossadati Computational fluid dynamics (CFD) and artificial neural network (ANN) are used to examine the cooling performance of two electronic components in an enclosure filled with a Cu-water nanofluid. The heat transfer within the enclosure is due to laminar...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011006.
Published Online: March 9, 2011
...K. C. Yung; H. Liem; H. S. Choy; W. K. Lun This paper reports the thermal performance of a high-brightness light-emitting diode (LED) array package with a novel placement method on a printed circuit board (PCB). The precise heat transfer analysis and modeling using computational fluid dynamics (CFD...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011007.
Published Online: March 9, 2011
... is modeled using a commercial computational fluid dynamics code with typical underfloor blockages. Blockages are shown to have a significant impact on tile flow rates and rack inlet temperatures. Based on the detailed numerical study broad guidelines are presented on managing the underfloor blockages...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011003.
Published Online: March 3, 2011
..., a computational fluid dynamics-based thermal analysis software package, is performed. The results show excellent agreement between the results predicted by the SFP CTM with the data from the detailed model. The SFP CTM predicts the junction temperature of the four power-dissipating components and the heat flows...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041007.
Published Online: November 24, 2010
... equations under conditions of local thermal nonequilibrium using a finite-volume-based computational fluid dynamics code for conjugate fluid/porous/solid domains. Numerical results have been obtained for a wide range of contact resistances at the porous-solid interfaces, up to the limit of an effectively...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031007.
Published Online: September 9, 2010
... of material reduction. In this paper, methods based on computational fluid dynamics are used to study the effects of parameters such as (1) vertical alignment of the slots, (2) horizontal alignment of slots, (3) area of slots, (4) differential slot opening, and (5) zonal variation in heat generation...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021009.
Published Online: June 25, 2010
.... The computational fluid dynamics (CFD) software that is available has improved over the years. CFD software specific to data center thermal analysis has also been developed. This has improved the time lines of providing some quick analysis of the effects of new hardware into the data center. But it is critically...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031012.
Published Online: July 31, 2009
... heat exchangers extended surfaces Constructal theory computational fluid dynamics Industry, and particularly electronic industry, has the big exigency of raising the power of its devices and components, at the same time lowering the volumes occupied. This goes together with the need of ever...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031007.
Published Online: June 23, 2009
... of channel patterns, with results tabulated for general use. An approximate heat conduction model is used to estimate the effect of channel size and pattern on resistance to heat flow normal to the fluid layer. 08 12 2008 15 03 2009 23 06 2009 computational fluid dynamics heat...
Journal Articles
Article Type: Design Innovations
J. Electron. Packag. June 2009, 131(2): 025002.
Published Online: April 3, 2009
... theoretical capabilities are explored through optimization calculations and computational fluid dynamics simulations. It has been shown that through close coupling of the two thermal fluids the proposed hybrid heat sink can theoretically remove hot spot heat fluxes on the order of 1 kW / cm 2 and background...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021007.
Published Online: April 2, 2009
...Yutaka Kumano; Tetsuyoshi Ogura; Toru Yamada A novel computational fluid dynamics analysis method of predicting semiconductor junction temperatures precisely without modeling printed circuit board (PCB) line patterns was developed. First, PCBs are divided into multiple regions. The effective...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021001.
Published Online: March 27, 2009
...Christopher T. DeGroot; Anthony G. Straatman; Lee J. Betchen A numerical study has been undertaken to explore the details of forced convection heat transfer in finned aluminum foam heat sinks. Calculations are made using a finite-volume computational fluid dynamics (CFD) code that solves...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
Published Online: November 17, 2008
... simulation, computational fluid dynamics analysis and finite element analysis are performed. The assembly deformations in numerical simulation are compared with those obtained by Moiré images. It is confirmed that for a certain organic package PC can be a more severe condition that causes solder...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021002.
Published Online: April 15, 2008
... by computational fluid dynamics (CFD). The CTM + CFD approach predicts a significantly (20–30%) higher junction temperature as compared to the conventional CTM network solver method, even when the convection coefficient used in the latter case is obtained more accurately from CFD, rather than from handbook...