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Keywords: convection
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041001.
Published Online: November 17, 2011
...Jing He; Liping Liu; Anthony M. Jacobi Thermal analysis with comprehensive treatment of conjugate heat transfer is performed in this study for discrete flush-mounted heat sources in a horizontal channel cooled by air. The numerical model accounts for mixed convection, radiative exchange and two...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041007.
Published Online: November 24, 2010
... infinite resistance. As the contact resistance is increased to such high levels, the heat transfer is found to asymptote as conduction into the solid constituent of the foam is completely blocked. Even without conduction into the solid, a convective enhancement is obtained due to the presence of the foam...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031007.
Published Online: September 9, 2010
...Varghese Panthalookaran Natural convection cooling provides a reliable, cost-effective, energy-efficient and noise-free method to cool electronic equipment. However, the heat transfer coefficient associated with natural convection mode is usually insufficient for electronic cooling and it requires...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034501.
Published Online: June 12, 2009
... engineering solution for the convection heat transfer inside a two-dimensional rectangular porous media subjected to constant heat flux on one side is presented. The conduction in the fluid is set to zero, and for simplicity, a plug flow is considered. As a result, the non-local-thermal equilibrium equations...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 129–143.
Published Online: July 23, 2006
... undertaken to study partial and mixed UHF and UWT heating conditions on a buoyancy assisted convection cooling of simulated PCB forming one wall of the vertical channel while, the other wall was kept insulated. The current work considers moderate to high flow Reynolds number ( 14.1 × 10 3 ≤ Re ≤ 2.35 × 10 5...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 205–215.
Published Online: July 23, 2006
...Vipin Yadav; Keshav Kant The effect of array size and substrate thermal conditions upon heat transfer characteristics of an array of heated modules subjected to buoyancy assisted convection cooling in air is investigated. The comparative analysis of numerical and experimental data for multimodular...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 259–266.
Published Online: September 23, 2005
...A. Bhattacharya; R. L. Mahajan In this paper, we present our recent experimental results on buoyancy-induced convection in aluminum metal foams of different pore densities [corresponding to 5, 10, 20, and 40 pores per in. (PPI)] and porosities (0.89–0.96). The results show that compared to a heated...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 106–112.
Published Online: June 3, 2005
... integrated circuit testing heat sinks jets shear turbulence stagnation flow temperature distribution convection flow separation cooling Continued miniaturization of integrated chips is a consequence of recent developments in semiconductor technology and integrated circuit manufacturing...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 523–529.
Published Online: May 3, 2005
...S. Kong Wang; Tzu-Chen Hung; Bau-Shi Pei; An-Fong Chen; Ja-Lin Du Two-dimensional convection heat transfer on a chip with a flow-disturbing obstruction block above it, as induced by natural coupling between flow and structure, was investigated numerically. The effects of various induced...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 519–523.
Published Online: January 24, 2005
...Siddharth Bhopte; Musa S. Alshuqairi; Dereje Agonafer, Fellow ASME; Gamal Refai-Ahmed, Fellow ASME The current numerical investigation will examine the effect of an impinging mixed convection air jet on the heat transfer rate of a parallel flat plate heat sink. A three-dimensional numerical model...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 465–471.
Published Online: January 24, 2005
.... Sammakia. 27 April 2004 31 May 2004 24 01 2005 electronics packaging cooling product design convection turbulence flow simulation finite volume methods Cooling of electronic components is one of the main barriers to developing faster, smaller, and more reliable...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 342–350.
Published Online: October 6, 2004
... 01 Feb 2004 06 10 2004 heat sinks flow through porous media permeability aluminium convection Today’s trend in the electronic equipment industry toward denser and more powerful products requires a higher level of performance from cooling technology. Many ideas for cooling...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 159–172.
Published Online: April 30, 2004
... performance are the steady-state Grashof number, jet Reynolds number, and ratio of jet separation distance to nozzle diameter. In addition, an effective time, t on , representing a certain transient time when the mixed convection effect due to jet impingement and buoyancy becomes significant relative to heat...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 126–133.
Published Online: March 14, 2003
... on conduction heat transfer, with treatments for convection and radiation embedded inside. The whole solution domain is first divided into two main sub-domains, namely, the melting sub-domain and the solidification sub-domain. Each sub-domain is then analyzed for a number of temporal regimes. Accordingly...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 152–159.
Published Online: October 20, 1999
...Nestor V. Queipo; Guy F. Gil This paper presents a solution methodology for the optimal placement of convectively and conductively air-cooled electronic components on planar printed wiring boards considering thermal and electrical/cost design objectives. The methodology combines the use of a heat...