... . Manuscript received May 2002. Associate Editor: Z. Suo. 01 May 2002 17 09 2003 gallium arsenide III-V semiconductors brittle fracture crack-edge stress field analysis soldering indium lead packaging finite element analysis Gallium arsenide (GaAs) semiconductors...

... circuit packaging plastic packaging integrated circuit reliability failure analysis thermal stress cracking crack-edge stress field analysis delamination finite element analysis Semiconductor packaging requirements for high-density cost-effective performance has resulted in flip chip design...

... then be determined using ( 16 ) and ( 18 ). thin films multilayers internal stresses fracture mechanics stress-strain relations crack-edge stress field analysis Many engineering devices are constructed by bonding multi-layers of different materials. For example, multi-layered structures...

... mechanics circuit reliability printed circuits plastic deformation thermal stress cracking crack-edge stress field analysis delamination soldering finite element analysis The last decade witnessed an explosive growth in the research and development efforts devoted to solder bumped flip chips...

... received by the EEPD August 9, 1999; revised manuscript received April 13, 2000. Associated Technical Editor: B. Michel. 09 August 1999 integrated circuit technology thermal stress cracking crack-edge stress field analysis thermoelasticity temperature distribution stress relaxation...