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Keywords: design
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021004.
Paper No: EP-13-1076
Published Online: April 29, 2014
... surface. heat sink microchannel heat transfer design Mini heat sinks are widely applied in modern electronic device to rapidly force heat away from heating units. They are normally constructed as a solid metal core that mounts directly atop the heating unit. The upper side of a mini heat...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031003.
Published Online: September 14, 2011
..., temperature of the hot side, and coefficient of performance without the need of using any manufacturer’s proprietary data. In addition, the MGM is designed to analyze a multidimensional-heat-transfer-system utilizing thermoelectric modules (Phan, H., and Agonafer, D., 2010, “Experimental Analysis Model...
