.... Presented at Esime2002, Paris, April 2002. integrated circuit packaging integrated circuit interconnections integrated circuit modelling integrated circuit reliability integrated circuit testing finite element analysis indentation viscoelasticity dielectric materials polymer films thin...

... devices polymers dielectric materials fracture delamination thermal stress cracking aluminium silicon To fabricate interconnect bump with BCB passivation, the adhesion promoter (AP3000 [Vinyltriacetoxysilane]) and BCB (Cyclotene™ 4024) were spin-coated on p-type (100) Si substrates...

... itself. To complement these fracture properties in microelectronic applications, the moisture content and thermal stability of Photo-BCB were also measured, in situ on thermally oxidized silicon wafer. Polymer dielectric materials such as polyimide and benzocyclobutene (BCB) have been in use as thin...