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Keywords: dielectric thin films
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 125–129.
Published Online: October 11, 2005
... conductivity of the high thermal conductivity film layers, with thicknesses between 100 and 500 μ m . 14 01 2005 11 10 2005 thermal management (packaging) heat sinks integrated circuit packaging substrates thermal conductivity measurement dielectric thin films thermal conductivity...
Journal Articles
Article Type: Technology Review
J. Electron. Packag. December 2005, 127(4): 530–536.
Published Online: December 22, 2004
... dielectric thin films integrated circuit packaging reviews In microelectronic manufacturing processes such as wafer processing, packaging, and assembling, polymers are more and more used because of their excellent insulation properties, low dielectric constant, and good chemical resistance. Due...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 390–397.
Published Online: October 6, 2004
... in the film continuously. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received April 2004. Associate Editor: Y. C. Lee. 01 April 2004 06 10 2004 ageing polymer films dielectric thin films...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 362–366.
Published Online: December 12, 2002
..., London, United Kingdom, December 4–5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 polymer films chemical mechanical polishing copper dielectric thin films permittivity surface topography...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 77–85.
Published Online: November 22, 1999
.... Shiratori. multichip modules dielectric thin films stainless steel substrates Stainless steel offers numerous advantages over traditional electronic materials due to its superior strength-to-weight ratio, flexibility, corrosion resistance, impact strength, thickness, thermal conductivity...