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Keywords: dimple
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021001.
Paper No: EP-13-1044
Published Online: April 29, 2014
... of thermal performance in all cases. Figure 7 presents the performance evaluation plot including all cases in this paper. For the sake of comparisons, we also include cases for microchannels with dimples and protrusions in this figure. The statistics of dimpled microchannels were published in our previous...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 157–166.
Published Online: July 3, 2006
...Carlos Silva; Egidio Marotta; Leroy Fletcher The use of dimple technology for improvement in friction factors and enhancement of heat transfer has been attracting the attention of many scientists and engineers. Numerical and experimental studies have shown there is a positive improvement (two-fold...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 63–70.
Published Online: March 2, 2006
...X. J. Wei; Y. K. Joshi; P. M. Ligrani Steady, laminar flow and heat transfer, inside a rectangular microchannel with a dimpled bottom surface, are numerically studied. The microchannel is 50 × 10 − 6 m ( 50 μ m ) deep and 200 × 10 − 6 m ( 200 μ m ) wide. The dimples are placed in a single row along...