... plated on alumina is ductile enough to deform for its surface to mate with the thin Au layer coated on Si. Au atoms on both sides of the bond line are brought within atomic distance and bonding is achieved. The ductile Au joint also accommodates the significant mismatch in coefficient of thermal...

... fatigue life, and ductility exhaustion model were applied to the experimental data, but no methods accurately predicted the creep-fatigue life. A new method based on the strain rate ratio, which predicted the creep-fatigue life within a factor of 4 scatter band, was developed. Quality assurance...

... scale packaging plastic deformation ball grid arrays flip-chip devices fatigue ductility stress-strain relations lead bonding integrated circuit interconnections finite element analysis Wafer Level Packaging Chip Scale Package Wire Interconnect Technology The function and design...