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Keywords: elastic modulus
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021004.
Paper No: EP-18-1042
Published Online: February 4, 2020
...Zuozhu Yin; Fenglian Sun; Mengjiao Guo In electronic packaging, most researchers are mainly focused on the mechanical properties of Cu–Sn intermetallic compounds (IMCs) at room temperature; few studies have looked into the relationship between hardness, elastic modulus, and plasticity of IMCs...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011002.
Published Online: February 11, 2009
... 2007 17 04 2008 11 02 2009 annealing copper alloys grain boundary diffusion hardness hardness testing high-temperature effects silver alloys solders thermal diffusion tin alloys thermomigration lead-free hardness elastic modulus grain coarsening...
