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Keywords: electric packaging
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041010.
Paper No: EP-13-1102
Published Online: September 19, 2014
... the objective of this work to determine the behavior of a typical electronic board subject to severe shock loads and the means to protect these electronics. electric packaging shock load finite element potting bilayered media attenuation drop weight test Shock loads which are characterized...
