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Keywords: electronics cooling
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041011.
Paper No: EP-21-1119
Published Online: January 28, 2022
... ,” 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ( ITherm ), Las Vegas, NV, May 28–31, pp. 540 – 545 . 10.1109/ITHERM.2019.8757380 [6] Chu , R. C. , 2004 , “ The Challenges of Electronic Cooling: Past, Current and Future ,” ASME J...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041103.
Paper No: EP-21-1083
Published Online: August 27, 2021
.... , and Arik , M. , 2016 , “ An Investigation Into Flow and Heat Transfer of an Ultrasonic Micro-Blower Device for Electronics Cooling Applications ,” Appl. Therm. Eng. , 106 , pp. 881 – 889 . 10.1016/j.applthermaleng.2016.06.094 [9] Ghaffari , O. , Ikhlaq , M. , and Arik , M...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. March 2021, 143(1): 010801.
Paper No: EP-20-1051
Published Online: June 29, 2020
... thermal management electronics cooling heat guiding heterogeneous package Metamaterials are structures that are artificially engineered to obtain properties that are not available in nature. For instance, advances in optical metamaterials have allowed sophisticated control over light...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011006.
Paper No: EP-19-1100
Published Online: June 4, 2020
...:  minghai@upc.edu.cn e-mail:  yogendra.joshi@me.gatech.edu 20 10 2019 15 02 2020 04 06 2020 metal foam heat sink heat transfer electronics cooling With the emerging trend toward heterogeneous integration, multiple heat-dissipating devices with vastly different heat...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021004.
Paper No: EP-14-1024
Published Online: June 1, 2015
... December 3, 2014. Assoc. Editor: Siddharth Bhopte. 22 02 2014 31 10 2014 03 12 2014 The paper reports the thermal performance of a nanofluid (MCNT/water) charged heat pipe with phase change material (PCM) as energy storage material (ESM) for electronic cooling. The adiabatic...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041005.
Paper No: EP-13-1106
Published Online: September 19, 2014
... designs critical for faster penetration of LED systems into general lighting applications. LED cooling natural convection heat sink chimney electronics cooling A19 bulb Over the last decade, LED lighting has been growing at a rapid rate, replacing many other traditional light sources...
Journal Articles
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024001.
Paper No: EP-13-1081
Published Online: April 29, 2014
... dissipation of large heat fluxes with significantly lower pressure drops. cooling 3D IC review single-phase cooling electronics cooling flow boiling microchannels Various fabrication techniques have evolved to produce multiple device layers on a single chip. Further discussion...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021007.
Paper No: EP-13-1082
Published Online: April 29, 2014
... of 34 kPa as compared to a temperature variation of 38 K and a pressure drop of 144 kPa with continuous fins and 51 K and 21 kPa for a smooth flow channel. 3D IC electronics cooling numerical simulation temperature nonuniformity pressure drop High heat flux removal from evolving IC...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041004.
Published Online: November 23, 2010
... electronics cooling thermal analysis MEMS The benefits of operating microprocessors, analog-to-digital converters, detectors, and other advanced semiconductor devices at subambient temperatures are well-established. Indeed, solid-state refrigerators based on the Peltier effect have been a subject...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021001.
Published Online: May 19, 2010
... designs, which minimize adverse scaling phenomena. 09 06 2009 26 01 2010 19 05 2010 19 05 2010 blades centrifugal casting cooling fans miniature fans centrifugal flow blade design scaling phenomena electronics cooling Continual advancements...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034501.
Published Online: June 12, 2009
... 11 2007 18 02 2009 12 06 2009 convection flow through porous media metal foams convection heat sink metal foam graphite foam electronics cooling Commercially produced metal foams are typically made from aluminum, nickel, steel, copper, and some of their alloys...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011007.
Published Online: February 4, 2008
... pool boiling microporous enhancement electronics cooling heat spreader experimental Historically the power dissipated from a microprocessor has increased with its computing performance. To slow this trend, microprocessor architectures are being designed with multiple processor cores...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 53–60.
Published Online: July 30, 2005
... pressure drop at moderate and high pin spacing, but have only minor influence on heat transfer. 24 10 2004 30 07 2005 thermal management (packaging) integrated circuit packaging heat sinks cooling pin fins heat sink bypass tip leakage electronics cooling The demand...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 61–70.
Published Online: June 14, 2005
... with increasing Re number, pin density, and pin diameter. 13 12 2004 14 06 2005 heat sinks heat transfer jets thermal management (packaging) pin fin heat sinks impinging jet electronics cooling In order to extend the usefulness of direct air cooling in the thermal management...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 178–185.
Published Online: June 10, 2003
... integrated circuit packaging thermal management (packaging) Conduction Electronics Cooling Heat Spreaders Heat Sinks Spreading Resistance Thermal spreading resistance results from discrete heat sources in many engineering systems. Typical applications include cooling of electronic devices...
Topics: Heat, Temperature
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 165–172.
Published Online: December 26, 2000
... confined flow stagnation flow Jet Impingement Air Jets Multiple Jets Electronics Cooling The enhanced heat and mass transfer rates obtained through the use of impinging jets have made them an attractive alternative in industrial applications ranging from the annealing of steel...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2000, 122(3): 282–285.
Published Online: December 1, 1999
... of THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS . Manuscript received by the EEPD February 1999; revised manuscript received December 1999. Associate Technical Editor: R. Wirtz. 01 February 1999 01 December 1999 heat sinks heat transfer thermal resistance nozzles jets Electronics...