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Keywords: electronics packaging
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041111.
Paper No: EP-20-1028
Published Online: June 29, 2020
... optimal control [ 55 ] and model predictive control (MPC) [ 56 ]. Of particular interest to the high-power electronics packaging community is the ability to predict and avoid dangerous operating conditions for components directly cooled by two-phase flow. Yang et al. [ 56 ] showed that a physics-based...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041014.
Published Online: December 21, 2011
... Two Layer Structure ,” Int. J. Electron. Packag. , 19 ( 3 ), pp. 323 – 329 . 9 Mirman , I. B. , 1991 , “ Effects of Peeling Stress in Bimaterial Assembly ,” ASME J. Electron. Packag. , 11 , pp. 431 – 433 . 10.1115/1.2905433 10 Moore , T. D. , and Jarvis , J. L...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041013.
Published Online: December 19, 2011
...Etienne L. Bonnaud Reliable drop test simulations of electronic packages require reliable material characterization of solder joints. Mechanical properties of lead-free solder were here experimentally investigated for both monotonic and cyclic loading at different strain rates. With regards...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041006.
Published Online: December 9, 2011
..., but time- and temperature-dependence. For simplification of the stress constitutive models, particularly for applications on electronic packaging can be found in literature, the time-dependent behavior could be neglected. Otherwise, the property only considered as a function of temperature can achieve time...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2011, 133(4): 044501.
Published Online: November 17, 2011
...Yongchang Lee; Cemal Basaran Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031013.
Published Online: September 30, 2011
..., even if the total applied power remains within current design rules of electronic packaging. To investigate that issue, a high power density was simulated from a small heating zone that was localized on the top surface of the upper chip, as seen in Fig. 4 . Table 4 shows the representative network...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031004.
Published Online: September 14, 2011
.... 657 – 667 . 5 Qin , F. , An , T. , Chen , N. , and Bai , J. , 2009 , “ Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates ”, ASME J. Electron. Packag. , 131 ( 3 ), pp. 0310011 – 0310016 . 10.1115/1.3144151 6 Solomon , H. D. , 1986...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031006.
Published Online: September 14, 2011
...M. O. Özdemir; H. Yüncü The objective of this study is to predict numerically the optimal spacing between parallel heat generating boards. The isothermal boards are stacked in a fixed volume of electronic package enclosed by insulated lateral walls, and they are cooled by laminar forced convection...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031002.
Published Online: September 14, 2011
.... Phys. , 102 ( 3 ), pp. 033705 . 10.1063/1.2761434 15 Jing , J. P. , Liang , L. H. , and Guang , M. , 2010 , “ Electromigration Simulation for Metal Lines ”, ASME J Electron. Packag. , 132 ( 1 ), pp. 1 – 7 . 10.1115/1.4000716 16 Reddy , J. N. , 2006...
Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2011, 133(2): 020301.
Published Online: July 1, 2011
...Tarek Ragab, Dr.; Cemal Basaran, Dr. carbon nanotubes chirality electron field emission electronics packaging mechanical strength molecular dynamics method nanoelectronics semiconductor nanotubes Since the first identification of carbon nanotubes in 1991, more than 60,000 research...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021005.
Published Online: June 23, 2011
...) are able to correspond to profiles found in XRD database, showing that 304SS has face-centered cubic crystal lattice. The Ni strike technique is used as surface treatment to make 304SS bondable to other metals, such as silver (Ag), copper (Cu), and gold (Au), commonly used in electronic packaging. Cross...
Journal Articles
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020902.
Published Online: June 7, 2011
...Drazen Fabris; Michael Rosshirt; Christopher Cardenas; Patrick Wilhite; Toshishige Yamada; Cary Y. Yang Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages and reduce high temperatures. TIMs are generally composed of highly conductive particle...
Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2011, 133(1): 010301.
Published Online: March 10, 2011
... was created for an opto-electronic package, and validated by experiments. The presented method gives a very good case study for such exercises. In the paper of Martinez-Galvan et al., “Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134a,” experimental measurements...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011009.
Published Online: March 10, 2011
... output only about 3% lower than that of the FTWL package. electronics packaging light emitting diodes phosphors silicon compounds light emitting diode correlated color temperature color-rendering index total internal reflection lumens Another important characteristic of a white...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011010.
Published Online: March 10, 2011
.... A comparison study between the results from the CFD simulation and the ANN analysis indicates that the ANN accurately predicts the cooling performance of electronic components within the given range of data. computational fluid dynamics cooling copper electronics packaging laminar flow nanofluidics...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011005.
Published Online: March 9, 2011
... ,” Internal Note ISTI 2007-B4-006. 30 11 2009 18 01 2011 09 03 2011 09 03 2011 electronics packaging finite element analysis power electronics thermal analysis The program DJOSER for the steady-state thermal analysis of multilayer assembling structures for power...
Journal Articles