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Keywords: electrostatic force
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011005.
Paper No: EP-19-1027
Published Online: September 19, 2019
... ]. In addition, electrostatic forces will also be considered in all simulations by developing a new loading program in finite element method (FEM) tool, such as abaqus . Similar FEM tools have been validated and used for a long time to predict the fatigue life of the IC package industry [ 21 – 24 ]. The new...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031002.
Published Online: July 29, 2008
... and the microstructure, which can be a beam or a plate. The mechanical shock is represented as a single point force impacting the PCB. The effects of the fundamental natural frequency of the PCB, damping, shock pulse duration, electrostatic force, and their interactions are investigated. It is found that neglecting...
