... in the model. The multiple transistors on the silicon chip are modeled by superimposing the results from the finite element analysis. 14 09 2010 23 08 2011 23 12 2011 23 12 2011 elemental semiconductors finite element analysis microprocessor chips semiconductor device models...

... 2011 adhesive bonding copper electronics packaging elemental semiconductors gold plates (structures) shear strength silicon solders thermal stresses thin films tin bimaterial assembly interfacial shearing stress peeling stress shear compliance bond layer...

... and two-sided palladium-bonded interfaces achieved thermal resistances near 10 mm 2 K/W and 5 mm 2 K/W, respectively. 01 12 2009 13 01 2011 23 06 2011 23 06 2011 carbon nanotubes elemental semiconductors interface structure mechanical stability MIS structures organic...

... silicon chip alumina substrate adhesive bonding alumina ductility elemental semiconductors gold integrated circuit bonding scanning electron microscopy silicon thermal expansion 22 10 2010 26 02 2011 22 06 2011 22 06 2011 2011 American Society of Mechanical...

.... 09 10 2009 26 03 2010 23 06 2010 23 06 2010 cooling electronics industry elemental semiconductors heat pipes microfabrication silicon thermal conductivity thermal resistance microheat pipes electronic cooling thermal conductivity thermal resistance performance...

... ) as a function of the temperature at 0 Pa. The dashed and solid lines correspond to a second-order polynomial fitting of the experimental results. 22 09 2008 27 03 2009 31 07 2009 electronics packaging elemental semiconductors finite element analysis membranes moulding...

... that is positioned at the outermost V-groove in the array, cannot be ignored. Manuscript received January 7, 2004; revision received August 13, 2004. Review conducted by: Y. C. Chan. 07 January 2004 13 August 2004 21 03 2005 silicon elemental semiconductors semiconductor device...

... . Manuscript received February 2003; final revision, February 2004. Associate Editor: A. Y-H. Hung. 01 February 2003 01 February 2004 06 10 2004 titanium metallic thin films fracture toughness internal stresses delamination surface cracks adhesion silicon elemental...

... 01 November 2003 08 07 2004 silicon elemental semiconductors grinding finite element analysis integrated circuit manufacture Until recently, internal-diameter (ID) sawing had been the dominant slicing method for the past three decades 11 12 . Wire sawing, however, is now...

.... 01 March 2003 30 04 2004 silicon elemental semiconductors surface roughness surface morphology fracture toughness polishing sputter etching grinding In recent years, the rapid market growth in portable and hand-held products challenges the electronic packaging industry...

.... T. Read. 20 August 1999 23 July 2001 26 07 2002 diamond CVD coatings adhesion fracture toughness elemental semiconductors semiconductor thin films nanostructured materials Synthetic polycrystalline diamond films produced by chemical vapor deposition (CVD...