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Keywords: elemental semiconductors
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
Published Online: December 23, 2011
.... 14 09 2010 23 08 2011 23 12 2011 23 12 2011 elemental semiconductors finite element analysis microprocessor chips semiconductor device models semiconductor device packaging silicon temperature distribution thermal analysis thermal management (packaging) transistors...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041014.
Published Online: December 21, 2011
... adhesive bonding copper electronics packaging elemental semiconductors gold plates (structures) shear strength silicon solders thermal stresses thin films tin bimaterial assembly interfacial shearing stress peeling stress shear compliance bond layer Thermomechanical stresses...
Journal Articles
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020907.
Published Online: June 23, 2011
... and two-sided palladium-bonded interfaces achieved thermal resistances near 10 mm 2 K/W and 5 mm 2 K/W, respectively. 01 12 2009 13 01 2011 23 06 2011 23 06 2011 carbon nanotubes elemental semiconductors interface structure mechanical stability MIS structures organic...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021003.
Published Online: June 22, 2011
... be coated with smooth Au layers. The 260 °C bonding temperature is compatible with typical reflow temperature of Sn3.5Ag solders used in electronic industries. 22 10 2010 26 02 2011 22 06 2011 22 06 2011 adhesive bonding alumina ductility elemental semiconductors gold...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021005.
Published Online: June 23, 2010
... 26 03 2010 23 06 2010 23 06 2010 cooling electronics industry elemental semiconductors heat pipes microfabrication silicon thermal conductivity thermal resistance microheat pipes electronic cooling thermal conductivity thermal resistance performance enhancement...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031013.
Published Online: July 31, 2009
... and surface mount device compatible features, making it suitable for portable commercial devices. 22 09 2008 27 03 2009 31 07 2009 electronics packaging elemental semiconductors finite element analysis membranes moulding photoresists piezoresistive devices pressure sensors...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 25–28.
Published Online: March 21, 2005
... that is positioned at the outermost V-groove in the array, cannot be ignored. Manuscript received January 7, 2004; revision received August 13, 2004. Review conducted by: Y. C. Chan. 07 January 2004 13 August 2004 21 03 2005 silicon elemental semiconductors semiconductor device...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 301–307.
Published Online: October 6, 2004
... February 2004 06 10 2004 titanium metallic thin films fracture toughness internal stresses delamination surface cracks adhesion silicon elemental semiconductors semiconductor-metal boundaries fracture toughness testing Knowledge of the mode mix dependent interfacial fracture...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 177–185.
Published Online: July 8, 2004
... PACKAGING . Manuscript received February 2003; final revision, November 2003. Associate Editor: M. Saka. 01 February 2003 01 November 2003 08 07 2004 silicon elemental semiconductors grinding finite element analysis integrated circuit manufacture Semiconductor wafers...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 110–114.
Published Online: April 30, 2004
.... 01 March 2003 30 04 2004 silicon elemental semiconductors surface roughness surface morphology fracture toughness polishing sputter etching grinding In recent years, the rapid market growth in portable and hand-held products challenges the electronic packaging industry...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 271–276.
Published Online: July 26, 2002
... fracture toughness elemental semiconductors semiconductor thin films nanostructured materials Synthetic polycrystalline diamond films produced by chemical vapor deposition (CVD) methods are being used for many applications due to their excellent properties (Spear 1 ) such as the highest known...