... than other restraint technologies. In potted electronic assemblies, interfacial delamination at the epoxy and printed circuit board (PCB) interface has been one of the major failure modes. Interfacial delamination happens at the epoxy/PCB interface under dynamic shock loads, which leads to failures...

... characterized. In this paper, we present extensive experimental data on thermally and UV-cured epoxies, typically used in photonic packages to enable stochastic analysis. We perform dynamic mechanical analysis over a wide frequency and temperature range to determine the viscoelastic behavior of the epoxies. We...