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Keywords: failure (mechanical)
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011009.
Published Online: February 13, 2009
...Michael R. Maughan; Robert R. Stephens; Donald M. Blackketter; Karl K. Rink In ongoing research at the University of Idaho, potential failure mechanisms of airbag initiators are being investigated. Cracking of the cylindrical glass-to-metal seal (GTMS) present in these devices has been observed...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011003.
Published Online: February 11, 2009
... (Fig. 3 ). With the addition of the silicone coating, this problem is alleviated. It is expected that the structural integrity of the transformer can be improved with the application of the coating. 21 09 2007 22 04 2008 11 02 2009 cooling electronics packaging failure...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2004, 126(4): 560–564.
Published Online: January 24, 2005
.... The thermomechanical properties of underfill therefore become crucial factors to the service life of FCBGA. ball grid arrays flip-chip devices failure (mechanical) integrated circuit reliability integrated circuit packaging creep testing thermal stress cracking solders Young's modulus thermal...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 225–231.
Published Online: July 8, 2004
... leading to fracture and failure, and cyclic mechanical and thermal loading including rate, dwell time, and amplitude. solders failure (mechanical) finite element analysis nondestructive testing CCD image sensors electronics packaging 01 May 2003 01 January 2004 08 07 2004...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 100–105.
Published Online: April 30, 2004
... irreversible thermodynamics failure analysis finite element analysis materials testing failure (mechanical) 4 Effect of phase size λ 0 on load-displacement curve for miniature specimen 5 Comparison of Load-displacement curves for miniature specimen Figure 6...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
Published Online: December 12, 2002
... electron microscopy failure (mechanical) Microstructural examination on the cross-section of a post-impact ICA SM joint indicated the formation of an interface crack between the ICA and the copper pad, as shown in Fig. 10 . This clearly shows that there could be inadequate interfacial strength...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 48–54.
Published Online: September 3, 1999
... 1999 thermomechanical treatment fatigue testing thermal stresses soldering eutectic alloys tin alloys bismuth alloys lead alloys silver alloys failure (mechanical) packaging The behavior of the solder alloy and the joint throughout a thermal cycle (caused by either internal...