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Keywords: fan-out
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Journal Articles
John H. Lau, Gary Chang-Fu Chen, Channing Cheng-Lin Yang, Vincent Teng, Andy Yan-Jia Peng, Jones Yu-Cheng Huang, Hsing-Ning Liu, Y. H. Chen, Tzyy-Jang Tseng, Ming Li
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021001.
Paper No: EP-23-1025
Published Online: August 11, 2023
... and heterogeneous integration is investigated. The organic interposer of the hybrid substrate is fabricated by a fan-out chip-last on a temporary panel with two different kinds of dielectric materials, namely, the photo-imageable dielectric and the Ajinomoto Build-Up Film. These two hybrid substrates are supporting...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
Published Online: March 20, 2023
...Xuesong Zhang; Qian Wang; Chenhui Xia; Chaojie Zhou; Gang Wang; Jian Cai The technology of fan-out wafer level packaging (FOWLP) has been widely adopted for millimeter wave antenna-in-package (AiP) system integration with low interconnection parasitic parameters. Present AiP solutions using FOWLP...
