... in each element. The elements that have reached the damage threshold are removed from the structure to initiate and propagate fatigue crack. This successive initiation approach is used to model crack initiation and propagation in Pb-free solder material under thermomechanical loading. A case study...

... solder joint containing microelectronic packages. Material parameters relevant to the model are estimated via a coupled experimental and numerical technique. 05 01 2007 20 08 2007 15 04 2008 copper alloys creep fatigue cracks fatigue testing fracture mechanics integrated...

...David M. Pierce; Sheri D. Sheppard; Paul T. Vianco; Jerome A. Regent; J. Mark Grazier A general fatigue life prediction methodology, based on a unified creep plasticity damage (UCPD) model, was developed for predicting fatigue cracks in 95.5Sn–3.9Ag–0.6Cu (wt %) solder interconnects...

... nanoparticles soldering assembling fine-pitch technology fatigue testing mechanical testing delamination fatigue cracks fracture passivation silicon compounds To enhance solder bump reliability in flip chips on organic substrates, an epoxy-based underfill is often dispensed along the sides...

... of Coffin–Manson equation employed for fatigue crack-initiation life of eutectic 63Sn–37Pb solder material are: E = 24.83 MPa , σ f ′ = 0.397 , ϵ f ′ = 0.396 , b = − 0.115 , and c = − 0.6 ( 19 ). The parameters...

... today, the model predicts that forces on the order of only one newton can significantly impede or accelerate the propagation of a fatigue crack. The relative life equations are plotted in Fig. 6 for applied shear strains up to 0.2%. The curves are generated assuming m = 4 , after...

...Ki-Ju Kang; Seon-Ho Choi; Tae-Sung Bae Fatigue tests were performed using single lap-joint specimens to obtain near-threshold fatigue crack growth data of solder joint under mode-II load. Attention was focused on the effect of high temperature aging and microstructures separately from...

.... Associate Editor: Yi-Hsin Pao. 26 June 2000 26 07 2002 soldering fatigue cracks Analytical models in engineering have several practical uses: 1) rapid design optimization during the development phase of a product, 2) predicting field use limits, and 3) failure analysis...

... greater than under static loading, indicating that stress corrosion effects are negligible and that crack tip plasticity controls cyclic fatigue crack growth at silane (3-APES) bonded epoxy/glass interfaces. After aging at 94°C in water, these silane bonded epoxy/glass interfaces exhibited somewhat...

... growth or fatigue cracks, determine the damage growth rate; (2) at an intermediate mesoscale, the localized damage bands are modeled as variable stiffness springs connecting undamaged materials; and (iii) at the macroscale or the continuum level, the localized damage band growing in an otherwise...

...J. Zhao and; Y. Mutoh; T. Ogawa The stress ratio effect on the fatigue crack growth behavior of 95Pb-5Sn solder has been investigated. It is found that both Δ J and Δ K can correlate fatigue crack growth data well, which means that the crack growth behavior of the 95Pb-5Sn solder under...