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Keywords: fatigue life cycle
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031011.
Paper No: EP-18-1099
Published Online: May 24, 2019
.... 31 10 2018 27 02 2019 thermal cycling mechanical cycling electronics packaging reliability accelerated testing fatigue life cycle Flip–chip packaging delivers several advantages over other packaging methods, including more compact packaging and improved thermal management...
