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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 452–459.
Published Online: February 11, 2005
... level electronics cooling. The results are then extended to define a favorable power dissipation profile, the most favorable of which was found to be one where the power dissipation increases in the vertical direction. 20 09 2004 11 02 2005 file servers forced convection...