... gradient and thermal migration [ 10 , 11 ]. This effect is often mistakenly attributed to EM and contributes to solder damage. electromigration stress inelastic deformation finite element solder This study designed and produced a special microsolder specimen (Sn3.8Ag0.7Cu) to equalize...

... ]. Besides, it is practical to conduct the test and validate the simulations. This paper is organized as follows. Following this brief introduction, Sec. 2 presents the details of our finite element model of the drop weight test. Section 3 gives the simulation results for different potting cases. Section...

... the modulus of the interconnection materials, reducing the span of the PCB, or using either a very thin or a very thick PCB. 05 11 2004 30 03 2005 impact testing printed circuit testing stress-strain relations reliability electronic packaging drop impact finite element parametric...

... on the PCB have been developed and validated with finite element analysis. The analyses have shown that (i) the response of the PCB was dominated by the fundamental mode and (ii) the response of the PCB depends heavily on the ratio between the frequency of the PCB and the input acceleration pulse...