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Keywords: finite element method (FEM)
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011005.
Paper No: EP-19-1027
Published Online: September 19, 2019
.... The frequency effect of HCF was also to be included in the developed prediction model. Based on the test results, the accuracy of the empirical prediction equation is improved by including frequency effect. microelectromechanical systems (MEMS) finite element method (FEM) high cycle fatigue electrostatic...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011001.
Paper No: EP-13-1028
Published Online: November 22, 2013
... stress in the Cu 6 Sn 5 layer with the scallop edge is less than that with the flat edge. intermetallic compound (IMC) atomic diffusion diffusion-induced stress finite element method (FEM) solder joint During the soldering process, a layer of IMC forms with the aid of the chemical...
