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Keywords: flip-chip package
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Journal Articles

Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges

Y. W. Wang, M. Y. Tsai, Y. S. Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031001.
Paper No: EP-23-1070
https://doi.org/10.1115/1.4064354
Published Online: January 8, 2024
...Y. W. Wang; M. Y. Tsai; Y. S. Chou A relatively low-cost and easy-to-use strain gauge measurement is proposed here as an alternative method for simultaneously determining the thermally induced warpages and the coefficients of thermal expansion (CTEs) of the flip-chip packages with a cap (or lid...
View Article titled, Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of <span class="search-highlight">Flip</span>-<span class="search-highlight">Chip</span> <span class="search-highlight">Packages</span> With a Cap Using Strain Gauges
Open the PDF for Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of <span class="search-highlight">Flip</span>-<span class="search-highlight">Chip</span> <span class="search-highlight">Packages</span> With a Cap Using Strain Gauges in another window
Topics: Finite element methods, Flip-chip packages, Gages, Strain gages, Warping
Journal Articles

A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the Flip-Chip Package

J. W. Wan, W. J. Zhang, D. J. Bergstrom
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 473–478.
https://doi.org/10.1115/1.2804098
Published Online: March 13, 2007
...J. W. Wan; W. J. Zhang; D. J. Bergstrom In this article, we present a theoretical study on the concept known as critical clearance for flip-chip packages. The critical clearance phenomenon was first observed in an experiment reported by Gordon et al. (1999, “A Capillary-Driven Underfill...
View Article titled, A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the <span class="search-highlight">Flip</span>-<span class="search-highlight">Chip</span> <span class="search-highlight">Package</span>
Open the PDF for A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the <span class="search-highlight">Flip</span>-<span class="search-highlight">Chip</span> <span class="search-highlight">Package</span> in another window
Topics: Clearances (Engineering), Flip-chip packages, Solders, Design