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Keywords: flow simulation
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021013.
Published Online: April 21, 2009
... to that of the slot jet, especially in terms of high-flux heat dissipation. Unprecedented cooling fluxes, as high as 1127 W / cm 2 , are achieved with the circular jets without incurring CHF. 01 07 2008 08 01 2009 21 04 2009 cooling flow simulation jets microchannel flow thermal management...
Journal Articles
Article Type: Design Innovations
J. Electron. Packag. June 2009, 131(2): 025001.
Published Online: April 1, 2009
... biological organs cancer cooling dosimetry flow simulation laser applications in medicine photodynamic therapy semiconductor device packaging semiconductor lasers thermal management (packaging) tumours Esophageal cancer is a significant cause of cancer-related deaths in the United States...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 63–70.
Published Online: March 2, 2006
... for macroscale channels, can also be used to enhance heat transfer inside microchannels. 01 11 2005 02 03 2006 laminar flow microchannel flow flow simulation heat transfer dimple microchannel heat transfer enhancement Heat transfer inside flow passages can be enhanced...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 67–75.
Published Online: March 21, 2005
.... Manuscript received June 29, 2003; revision received June 27, 2004. Review conducted by: B. Sammakia. 29 June 2003 27 June 2004 21 03 2005 integrated circuit packaging thermal management (packaging) surface mount technology flow simulation computational fluid dynamics shear...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 519–523.
Published Online: January 24, 2005
... by: B. Sammakia. 21 May 2004 19 July 2004 24 01 2005 heat sinks electronics packaging plates (structures) cooling convection jets nozzles flow simulation finite volume methods telecommunication During the last decade, there was a significant growth in heat...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 528–534.
Published Online: January 24, 2005
... flow simulation jets optimisation numerical analysis Enhancement of the cooling of electronic modules and packages can be accomplished by a variety of techniques, such as increasing the air flow rate, increasing the surface area through the use of heatsinks, or improving the air flow...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 423–428.
Published Online: January 24, 2005
... ventilation natural convection numerical analysis flow simulation The power dissipation density of electronic equipment has increased in recent years and, as a result, it is necessary to consider the cooling design of electronic equipment in order to develop suitable cooling techniques...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 435–439.
Published Online: January 24, 2005
... transfer temperature control rods (structures) flow simulation IC Cooling Heat Spreader Mathematical Thermal Model 1D Non-Uniform Rod Once a first silicon device is fabricated, “real world” validation of the design begins. About 40% of first silicon designs 3 go through this design...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 465–471.
Published Online: January 24, 2005
.... Sammakia. 27 April 2004 31 May 2004 24 01 2005 electronics packaging cooling product design convection turbulence flow simulation finite volume methods Cooling of electronic components is one of the main barriers to developing faster, smaller, and more reliable...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 440–448.
Published Online: January 24, 2005
... packaging product development thermal analysis singular value decomposition Taguchi methods flow simulation product design computational geometry In various classes of electronic equipment the packaging density in the system box is rapidly rising. This is most visible in portable electronic...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 510–518.
Published Online: January 24, 2005
... May 2004 05 October 2004 24 01 2005 electronics packaging HVAC heat transfer computational fluid dynamics compressible flow flow simulation turbulence numerical analysis Heat loads of data processing equipment continue to increase at a rapid rate. This increasing heat...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 384–389.
Published Online: October 6, 2004
... 2003 01 April 2004 06 10 2004 microprocessor chips thermal resistance integrated circuit packaging flip-chip devices thermal stresses temperature distribution cooling flow simulation In the past decade, simulation procedures and tools have improved tremendously in every...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 247–255.
Published Online: July 8, 2004
... permeability flow simulation aluminium temperature distribution The trend in electronics industry toward smaller and more powerful products has increased power density of electronic components, as shown in Fig. 1 . For reliable operation of these products, thermal modeling and design of electronic...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 186–194.
Published Online: July 8, 2004
... the proposed model is applicable for any geometric arrangement of solder bumps, rectangular-array of solder bumps layout was used first for comparison with experimental results of other article. Comparisons of the flow-front shapes and filling time with the experimental data indicated that the flow simulation...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 319–324.
Published Online: September 17, 2003
... sinks computational fluid dynamics thermal management (packaging) pressure flow simulation pipe flow The trend in modern electronic systems design is to increase the speed and power of processing while at the same time reducing the size and weight of the electronic device 1...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2001, 123(3): 315–318.
Published Online: October 5, 1999
... and Photonic Packaging Division of THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS . Manuscript received by the EPPD October 5, 1999. Associate Editor: R. Wirtz. 05 October 1999 heat sinks flow simulation computational fluid dynamics heat transfer finite element analysis With advances...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 20–27.
Published Online: August 17, 1999
... August 1999 semiconductor device packaging flow simulation finite element analysis microprocessor chips compressible flow encapsulation viscosity chip-on-board packaging Semiconductor chips are often encapsulated with an epoxy-molding compound (EMC) for protection and optimal use...