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Keywords: forced convection
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031003.
Paper No: EP-13-1046
Published Online: May 5, 2014
...% but with significant pressure drop of 300%. block cooling flow control forced convection conjugate heat transfer Convective heat transfer in a channel containing blocks is a subject of research interest in literature because of advances in electronic packaging. Thermal science researchers...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041009.
Published Online: December 9, 2011
... 24 05 2011 16 09 2011 09 12 2011 09 12 2011 cooling forced convection liquid metals thermal management (packaging) thermal resistance liquid metal thermosyphon effect thermal management chip cooling LED self support heat driven heat transfer enhancement...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031006.
Published Online: September 14, 2011
...M. O. Özdemir; H. Yüncü The objective of this study is to predict numerically the optimal spacing between parallel heat generating boards. The isothermal boards are stacked in a fixed volume of electronic package enclosed by insulated lateral walls, and they are cooled by laminar forced convection...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021001.
Published Online: March 27, 2009
...Christopher T. DeGroot; Anthony G. Straatman; Lee J. Betchen A numerical study has been undertaken to explore the details of forced convection heat transfer in finned aluminum foam heat sinks. Calculations are made using a finite-volume computational fluid dynamics (CFD) code that solves...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011011.
Published Online: February 13, 2009
... control forced convection conjugate heat transfer The electronic manufacturers are continuously providing the market with high performance devices with high heat dissipation. Heat highly affects the performance and durability of electronic devices more than any other factors, and operating...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031011.
Published Online: August 5, 2008
... it is recommended as an appropriate turbulence model for thermal analysis of electronic packaging. 09 02 2007 07 07 2007 05 08 2008 cooling electronics packaging forced convection thermal analysis turbulence Electronics are at the heart of any newborn modern equipment...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 432–440.
Published Online: February 27, 2006
.... , 1999 , “ Forced Convection Heat Transfer Augmentation in a Channel With a Localized Heat Source Using Fibrous Materials ,” ASME J. Electron. Packag. 1043-7398 , 121 , pp. 1 – 7 . Culham , J. R. , and Muzychka , Y. S. , 2001 , “ Optimization of Plate Fin Heat Sinks Using Entropy...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 172–176.
Published Online: February 16, 2006
... device can be easily retrofitted into existing systems; improving performance without major channel and/or fan modifications. 10 12 2004 16 02 2006 thermal management (packaging) heat sinks microprocessor chips integrated circuit packaging forced convection The state...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 305–310.
Published Online: February 10, 2006
.... The effect of location of the modules on a card with zero, one and two power planes is evaluated for thermal performance. Heat dissipation is studied for forced convection (2, 1, and 0.5 m ∕ s ). Comparison is made for single sided and back-to-back cases. 28 07 2003 10 02 2006 ball grid...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2006, 128(4): 484–493.
Published Online: January 9, 2006
...Jinny Rhee; Sergio I. Hernandez The effects of altitude, increased ambient temperature, and increased relative humidity on the board level forced convection typical of telecommunications products were systematically examined through numerical simulation and analytical techniques. Altitude was found...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 166–171.
Published Online: August 24, 2005
... that such discrepancy in the Nusselt number lead to an error of 6% in the prediction of the junction temperature of the device. 13 11 2004 24 08 2005 heat sinks heat transfer jets telecommunication equipment data communication equipment cooling forced convection thermal management (packaging...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 503–511.
Published Online: April 20, 2005
... they are embedded. The jets can be made to impinge upon electronic components thereby providing forced convection impingement cooling. The small size of these devices accompanied by the high exit air velocity provides an exciting opportunity to significantly reduce the size of thermal management hardware...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 474–482.
Published Online: March 18, 2005
... 03 2005 thermal management (packaging) heat sinks channel flow liquid crystals forced convection cooling In recent years, heat sink is the most common thermal management hardware in use in the electronics industry. From the existing literature survey ( 1 2 3 4 ), the extensive...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 452–459.
Published Online: February 11, 2005
... level electronics cooling. The results are then extended to define a favorable power dissipation profile, the most favorable of which was found to be one where the power dissipation increases in the vertical direction. 20 09 2004 11 02 2005 file servers forced convection...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 449–456.
Published Online: January 24, 2005
... on the backside of the die, and an overmolded die with and without a heat spreader have been studied by solving a conjugate heat transfer problem. These enhancements have been investigated under natural and forced convection conditions for freestream velocities up to 2 m/s. The following ranges of parameters have...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 172–177.
Published Online: December 23, 2004
... that is instrumented with a thermocouple. The case-to-ambient thermal resistance under natural convection with the heat sink is 3.15 ° C ∕ W . Forced convection with the synthetic jets enables a power dissipation of 59.2 W at a case temperature of 70 ° C , resulting in a case-to-ambient thermal resistance of 0.76 ° C...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 215–222.
Published Online: August 9, 2004
..., and forced convection conditions with the Reynolds number based on the channel hydraulic diameter ranging from 40 to 2220 and on the heat source length ranging from 50 to 2775. The heat flux ranges from 0.1 W ∕ cm 2 to 0.6 W ∕ cm 2 . The effects of heat flux, flow rates, and chip number are investigated...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 193–199.
Published Online: July 13, 2004
...H. Bhowmik; K. W. Tou Experiments are performed to study the single-phase transient forced convection heat transfer on an array of 4 × 1 flush-mounted discrete heat sources in a vertical rectangular channel during the pump-on transient operation. Water is the coolant media and the flow covers...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 247–255.
Published Online: July 8, 2004
... from forced convective flow between infinite parallel plates. To validate the compact model proposed in this paper, three aluminum straight fin heat sinks having a base size of 101.43 mm × 101.43 mm are tested with an inlet velocity ranging from 0.5 m/s to 2 m/s. In the experimental investigation...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 223–234.
Published Online: May 8, 2004
.... , and Tien , C. L. , 1988 , “ Effects of Thermal Dispersion on Forced Convection in Fibrous Media ,” Int. J. Heat Mass Transfer 0017-9310 10.1016/0017-9310(88)90013-0 , 31 , pp. 301 – 309 . Calmidi , V. V. , and Mahajan , R. L. , 2000 , “ Forced Convection in High Porosity Metal...