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Keywords: free edge stressClose
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041007.
Paper No: EP-19-1034
Published Online: October 18, 2019
... of the free edge stress of the glass substrate specimen becomes essential and needs to be performed using a finite element analysis during the 3PB test. Furthermore, a point-load on elastic foundation (PoEF) test, which features bi-axial stresses and can avoid the edge chipping effect caused by the dicing...