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Keywords: genetic algorithmsClose
Article Type: Technical Briefs
J. Electron. Packag. March 2011, 133(1): 014501.
Published Online: March 9, 2011
...Hsien-Cheng Tseng Advanced collector-up (C-up) heterojunction bipolar transistors (HBTs) with the thermal-via configuration (TVC) have been analyzed using a genetic algorithm (GA). Novel packaging structures are presented and evaluated in detail. With careful optimization, the thermal performance...
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041108.
Published Online: November 14, 2008
... sources to the heat sink. The objective of thickness distribution design is to reduce the variation among heat source temperatures and the maximum heat source temperature simultaneously. The genetic algorithm is used to search for an optimum thickness distribution. The problem is a generic representation...
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 90–97.
Published Online: April 19, 2006
... for high frequency signals, and critical component location which are optimized simultaneously using the genetic algorithm. A board-level thermal performance prediction methodology which is based on a combination of a superposition method and artificial neural networks is developed for this study. Two...