...-copper system with a gold-tin solder bond layer. The results obtained are likely to be useful in interfacial stress evaluation and physical design of bimaterial assemblies used in microelectronics and photonics applications. Consider a plate of unit thickness subjected to unit shear stress...

...Chu-Hsuan Sha; Pin J. Wang; Wen P. Lin; Chin C. Lee Silver (Ag) foils are bonded to alumina substrates by a low temperature solid state bonding process. The alumina substrate is premetalized with 40 nm titanium tungsten (TiW) and 2.54 μm gold (Au). The bonding temperature is just 260 °C, compatible...

...Chu-Hsuan Sha; Chin C. Lee Formation of pure silver (Ag) flip-chip interconnect of silicon (Si) chips on copper (Cu) substrates is reported. Arrays of Ag columns, each 36 μm in height and 40 μm in diameter, are fabricated on 2-in. Si wafers which are first coated with chromium (Cr)/gold (Au) dual...

...Chu-Hsuan Sha; Chin C. Lee Pure gold (Au) is used as a bonding medium to bond silicon (Si) chips to alumina substrates. The bonding process is performed at 260 °C with only 150 psi (1.0 MPa) static pressure applied. This is a solid-state bonding without any molten phase involved. The Au layer...

... 24 02 2010 24 09 2010 03 12 2010 03 12 2010 chip-on-board packaging contact resistance gold lead bonding tape automated bonding thin films tin In the past two decades, liquid crystal displays (LCDs) have a big market share in the industry of flat panel display...

... number per unit volume. The channels had rectangular cross-sections with hydraulic diameters ranging from 0.762 mm to 1.389 mm. Acetone, water, diamond/acetone, gold/water, and diamond/water nanofluids were tested as working fluids. It was found that the FP-OHP’s thermal resistance depended on the power...

... displacement model Group Name Inputvariation Response variation(tensile forces)(%) Response variation(compressive force)(%) Modulus of elasticity Shaft and collet ± 10 % 3.14 2.98 Gold bump ± 10 % 0.25 0.30 Aluminum pad ± 10 % 0.44 0.47 Epoxy layer...

.../Si), we have assessed the binding affinity of Au, Cr, and Si with Protein G, and antibodies for prostate specific antigen and cancer antigen 125, an ovarian cancer-associated antigen. Based on our experiments, we see that the thin gold layer of the Au/Cr/Si samples provides increased biomaterial...

... enhance the electromigration reliability. 01 08 2007 07 01 2008 13 11 2008 copper alloys electromigration flip-chip devices gold nickel reliability silver alloys solders tin alloys titanium vanadium electromigration flip-chip solder joint reliability Sn–Ag–Cu Cu...

... displacement plots of the shear test, three regions can be observed. Region I primarily exhibits elastic-plastic deformation occur, while crack nucleate in region II which propagates in region III which finally ends in a catastrophic failure. Fractographs reveal in the case of gold ball bonds shows fracture...

...Mithilesh Shah; Kaiyang Zeng; Andrew A. O. Tay The present work studies the mechanical properties of mechanically polished gold wire and wirebond using nanoindentation. Metallography of wirebond reveals undesirable coarse grain structure in HAZ due to recrystallization and grain growth. For our...

... drawback is copper’s low resistance to corrosion, which can lead to electrical failure of connectors. For this reason, a layer of gold is often plated on the surfaces of connectors to seal off the base metal from being directly exposed to the environment. As an economical practice, gold flashing has been...

...J. Puigcorbe´; S. Marco; S. Leseduarte; M. Carmona; O. Vendier; C. Devron; S. L. Delage; D. Floriot; H. Blanck The gold-gold thermocompression process for power heterostructure bipolar transistor (HBT) flip chip has been modelled and simulated by finite element method. A model for plated gold creep...

... geometries, resin diameter, nickel layer thickness, and gold layer thickness, is worked out from the physical model of an ACA particle. To carry out the solutions of the function, MathCAD software is applied. According to the numerical solutions, the deeper the particle transformation, the thicker the metal...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received February 2003. Associate Editor: E. Suhir. 01 February 2003 15 12 2003 gold copper aluminium integrated circuit interconnections integrated circuit packaging integrated circuit reliability ageing lead bonding hardness...