1-2 of 2
Keywords: grinding
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 177–185.
Published Online: July 8, 2004
...X. J. Xin; Z. J. Pei; Wenjie Liu Silicon is the primary semiconductor material used to fabricate microchips. The quality of microchips depends directly on the quality of starting silicon wafers. A series of processes are required to manufacture high quality silicon wafers. Surface grinding is one...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 110–114.
Published Online: April 30, 2004
... was determined predominantly by the geometry and scratch tip sharpness of a few large and deep scratches formed during wafer thinning. Although additional polishing by dry-polishing technique after traditional mechanical coarse/fine grinding could greatly improve the average roughness of the die surface...