.... An experimental set up was prepared where a TE device was used in conjunction with heat exchanger and a cold plate to remove heat from electronics module. A finned copper rod in contact with hot side of TE device was used to reject the heat out to the ambient. The experimental set up was housed inside...

... cooling cosmology heat exchangers heat transfer thermal resistance Heat spreading is essentially an area-enlarging: The larger the area that is in contact with the heat exchanger (often the ambient air), the more heat can be removed at the same temperature difference. Unfortunately, even...

...Giulio Lorenzini; Simone Moretti Thermal conductance and loss of pressure are among the most relevant parameters based on which a heat exchanger has to be chosen. Starting from this observation this study treated and compared the performances of different exchanging systems, always in condition...

...T. L. Bergman Heat transfer enhancement associated with use of a nanofluid coolant is analyzed for small electronic heat sinks. The analysis is based on the ε -NTU heat exchanger methodology, and is used to examine enhancement associated with use of H 2 O – Al 2 O 3 nanofluids in a heat sink...

... simulations were also conducted to guide the experimental program. Effective heat transfer coefficients were also reverse-engineered using CFD software and the experimental results. 18 01 2007 19 04 2007 computational fluid dynamics copper graphite heat exchangers power amplifiers...

... to other motherboard components, some of which required air-cooling. A number of limitations required a compact heat spreader and heat exchanger. The optimized design needed to enable the microprocessor temperature to be regulated and maintained between 60 and 100°C as the device power went up to 150 W 2...

... modules heat exchangers product development cooling Electronic devices and equipment now permeate virtually every aspect of our daily life. Among the most ubiquitous of these is the electronic computer varying in size from the handheld personal digital assistant to large scale mainframes...

... cooling thermal resistance heat exchangers forced convection thermal management (packaging) temperature distribution channel flow Cold Plate Thermal Resistance Nusselt Number Reynolds Number Heat Transfer Performance Factor Pumping Power Factor Colburn Analogy A cold plate device...

..., companies are looking for innovative methods of providing system level cooling such as using soil heat exchangers. Numerical simulation using a system of lumped thermal capacitances coupled to a soil finite element model is used to predict the transient thermal behavior of a cabinet. The cabinet model has...