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Keywords: heat exchangers
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041005.
Published Online: December 9, 2011
.... An experimental set up was prepared where a TE device was used in conjunction with heat exchanger and a cold plate to remove heat from electronics module. A finned copper rod in contact with hot side of TE device was used to reject the heat out to the ambient. The experimental set up was housed inside...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031004.
Published Online: September 9, 2010
... approach has severe limitations. A number of test cases are covered in detail and the results testify to this assertion. 15 11 2009 19 04 2010 09 09 2010 cooling cosmology heat exchangers heat transfer thermal resistance Heat spreading is essentially an area-enlarging...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031012.
Published Online: July 31, 2009
...Giulio Lorenzini; Simone Moretti Thermal conductance and loss of pressure are among the most relevant parameters based on which a heat exchanger has to be chosen. Starting from this observation this study treated and compared the performances of different exchanging systems, always in condition...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021008.
Published Online: April 2, 2009
...T. L. Bergman Heat transfer enhancement associated with use of a nanofluid coolant is analyzed for small electronic heat sinks. The analysis is based on the ε -NTU heat exchanger methodology, and is used to examine enhancement associated with use of H 2 O – Al 2 O 3 nanofluids in a heat sink...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 488–495.
Published Online: April 19, 2007
... simulations were also conducted to guide the experimental program. Effective heat transfer coefficients were also reverse-engineered using CFD software and the experimental results. 18 01 2007 19 04 2007 computational fluid dynamics copper graphite heat exchangers power amplifiers...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 435–439.
Published Online: January 24, 2005
...% over the entire temperature and power ranges. Manuscript received April 23, 2004; revision received June 22, 2004. Review conducted by B. Sammakia. 23 April 2004 22 June 2004 24 01 2005 integrated circuit packaging semiconductor device packaging heat exchangers heat...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 491–500.
Published Online: January 24, 2005
... modules heat exchangers product development cooling Electronic devices and equipment now permeate virtually every aspect of our daily life. Among the most ubiquitous of these is the electronic computer varying in size from the handheld personal digital assistant to large scale mainframes...
Topics: Cooling
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 104–113.
Published Online: March 14, 2003
... 21, 2001. Associate Editor: E. Lorenzini. 21 December 2001 14 03 2003 integrated circuit packaging cooling thermal resistance heat exchangers forced convection thermal management (packaging) temperature distribution channel flow Cold Plate Thermal Resistance...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 7–11.
Published Online: March 1, 2002
..., companies are looking for innovative methods of providing system level cooling such as using soil heat exchangers. Numerical simulation using a system of lumped thermal capacitances coupled to a soil finite element model is used to predict the transient thermal behavior of a cabinet. The cabinet model has...