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Keywords: heat of fusion
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021011.
Published Online: April 3, 2009
... of the PCM-based heat sink. 08 07 2008 04 12 2008 03 04 2009 algebra cooling heat conduction heat of fusion heat sinks phase change materials electronic cooling heat transfer melting phase change material protruding electronic component In a recent computer...
