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Keywords: heat pipes
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041009.
Published Online: November 24, 2010
...Peng Cheng; Scott Thompson; Joe Boswell; H. B. Ma The heat transfer performance of flat-plate oscillating heat pipes (FP-OHPs) was investigated experimentally and theoretically. Two layers of channels were created by machining grooves on both sides of a copper plate in order to increase the channel...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031005.
Published Online: September 9, 2010
...Koji Fumoto; Masahiro Kawaji; Tsuyoshi Kawanami This paper discusses a pulsating heat pipe (PHP) using a self-rewetting fluid. Unlike other common liquids, self-rewetting fluids have the property that the surface tension increases with temperature. The increasing surface tension at a higher...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021005.
Published Online: June 23, 2010
... (heat) moving through the specimen was needed in order to quantify the performance of the heat pipe array. Therefore, it was necessary to accurately measure the amount of thermal energy (heat) traveling through the test specimen. To achieve this end, a custom made calorimeter was used to measure...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031009.
Published Online: July 14, 2009
... to multiple heat sinks via four heat pipes. The copper block with embedded heat pipes or evaporator block was optimized using finite element analysis, and several cases were validated with experimental data. The experiments showed great benefits by having a second fan/heat sink in the device. The copper block...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. June 2009, 131(2): 024502.
Published Online: April 2, 2009
...K. N. Shukla An analytical expression for the heat transport capability of micro heat pipe is derived. The vapor continuum limitation has been considered in deriving the heat transport capability of a micro heat pipe. As the micro heat pipe uses sharp-cornered square, triangular, or other polygonal...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2006, 128(3): 294–296.
Published Online: October 11, 2005
... tests ought to be done with water and completely oxidized MHP surfaces, as the contact angle of water on silicon oxide is lower than on silicon. 11 10 2004 11 10 2005 heat pipes microchannel flow thermal conductivity electronics packaging microheat pipe experiment heat...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 378–385.
Published Online: September 17, 2003
...Ravi S. Prasher This paper introduces a simplified modeling scheme for the prediction of heat transport capability of heat pipes and vapor chambers. The modeling scheme introduced in this paper enables thermal designers to model heat pipes and vapor chambers in commercially available conduction...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 251–260.
Published Online: June 10, 2003
.... Culham. 12 October 2001 10 06 2003 heat pipes capillarity two-phase flow evaporation undercooling flow separation flow through porous media thermal conductivity pipe flow The control of operating temperature, regardless of power input, makes future use of CPL systems...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 164–169.
Published Online: July 26, 2002
...H. B. Ma; G. P. Peterson An extensive numerical analysis of the temperature distribution and fluid flow in a heat sink currently being used for cooling desktop computers was conducted, and demonstrated that if the base of a heat sink was fabricated as a heat pipe instead of a solid material...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 189–195.
Published Online: April 1, 2000
...Koichiro Take; Ralph L. Webb The air flow rate available for cooling of notebook computers is very limited. Thus, notebook computer manufacturers desire a “passive” cooling method. Heat pipes are typically used to transport the heat from the CPU to a forced convection, air-cooled condenser...